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Contract Details
| Title |
Resist Remove/high Throughput China |
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|---|---|---|---|---|
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| Country | ||||
| Language | English | |||
| Organization | ||||
| Published Date | 10.07.2024 | |||
| Awarded Date | 06.01.2019 | |||
| Overview | Contract Award's Details : Resist Remove/high Throughput Ceiec Country: China Resist Remove/high Throughput Contract Awarded for Resist remove/high throughput Project Name: 12 inch wafer manufacturing fab Purchasers: Nexchip semiconductor corporation Open-Time of Bids: :2018-12-28 10:00 Data of Evaluation Result: :20181228 19:32 20190102 23:59 Data of Bidding Result: :2019-01-07 09:07 China Contract value : See in details Contractors : TOKYO ELECTRON LIMITED See in details 07/01/2019 07/04/2019 12145769 07/01/2019 Ceiec Country: China Address : China China Contract Awards China 0714-1640HFJH0001/165 See in details 07/04/2019 See in details | |||
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| UNSPSC | ||||
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See in details
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China
| Title |
|---|
Resist Remove/high Throughput China |
| Country |
| Language |
| English |
| Organization |
| Published Date |
| 10.07.2024 |
| Awarded Date |
| 06.01.2019 |
| Overview |
| Contract Award's Details : Resist Remove/high Throughput Ceiec Country: China Resist Remove/high Throughput Contract Awarded for Resist remove/high throughput Project Name: 12 inch wafer manufacturing fab Purchasers: Nexchip semiconductor corporation Open-Time of Bids: :2018-12-28 10:00 Data of Evaluation Result: :20181228 19:32 20190102 23:59 Data of Bidding Result: :2019-01-07 09:07 China Contract value : See in details Contractors : TOKYO ELECTRON LIMITED See in details 07/01/2019 07/04/2019 12145769 07/01/2019 Ceiec Country: China Address : China China Contract Awards China 0714-1640HFJH0001/165 See in details 07/04/2019 See in details |
| NAICS |
| - |
| CPVS |
| Semiconductors |
| UNSPSC |
| Awards |
| Regions |
| APEC Countries Asia Eastern Asia |
| Sectors |
| Automobiles and Auto Parts Supply Construction Energy-Power and Electrical Computer Hardwares and Consumables |
| Contractor |
| Contract Value |
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See in details
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