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Contract Details
| Title |
Full Automatic Wafer Polishing And Grinding Machine And Full Automatic Wafer Coating Machine 1set Each China |
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| Country | ||||
| Language | English | |||
| Organization | ||||
| Published Date | 09.07.2024 | |||
| Awarded Date | 20.05.2018 | |||
| Overview | Contract Award's Details : Full Automatic Wafer Polishing And Grinding Machine And Full Automatic Wafer Coating Machine 1set Each Joc International Engineering Consulting Co.,Ltd Country: China Full Automatic Wafer Polishing And Grinding Machine And Full Automatic Wafer Coating Machine 1set Each Contract Awarded for Full automatic wafer polishing and grinding machine and full automatic wafer coating machine 1set each Project Name: Full automatic wafer polishing and grinding machine and full automatic wafer coating machine Purchasers: Jiangsu changjiang electronics technology co.,ltd. Open-Time of Bids: :2018-04-10 13:00 Data of Evaluation Result: :20180417 17:51 20180420 23:59 Data of Bidding Result: :2018-05-21 14:21 China Contract value : See in details Contractors : DISCO HI-TEC (CHINA) CO., LTD. See in details 21/05/2018 21/08/2018 10921118 21/05/2018 Joc International Engineering Consulting Co.,Ltd Country: China Address : China China Contract Awards China 0675-184JOC106033/04 See in details 21/08/2018 See in details | |||
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| CPVS | ||||
| UNSPSC |
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China
| Title |
|---|
Full Automatic Wafer Polishing And Grinding Machine And Full Automatic Wafer Coating Machine 1set Each China |
| Country |
| Language |
| English |
| Organization |
| Published Date |
| 09.07.2024 |
| Awarded Date |
| 20.05.2018 |
| Overview |
| Contract Award's Details : Full Automatic Wafer Polishing And Grinding Machine And Full Automatic Wafer Coating Machine 1set Each Joc International Engineering Consulting Co.,Ltd Country: China Full Automatic Wafer Polishing And Grinding Machine And Full Automatic Wafer Coating Machine 1set Each Contract Awarded for Full automatic wafer polishing and grinding machine and full automatic wafer coating machine 1set each Project Name: Full automatic wafer polishing and grinding machine and full automatic wafer coating machine Purchasers: Jiangsu changjiang electronics technology co.,ltd. Open-Time of Bids: :2018-04-10 13:00 Data of Evaluation Result: :20180417 17:51 20180420 23:59 Data of Bidding Result: :2018-05-21 14:21 China Contract value : See in details Contractors : DISCO HI-TEC (CHINA) CO., LTD. See in details 21/05/2018 21/08/2018 10921118 21/05/2018 Joc International Engineering Consulting Co.,Ltd Country: China Address : China China Contract Awards China 0675-184JOC106033/04 See in details 21/08/2018 See in details |
| NAICS |
| Paint Furniture Architectural Coating International Coating Research and Development in the Physical Electroplating Research and Development in the Physical |
| CPVS |
| Engineering, auxiliary, average, loss, actuarial and salvage insurance services Business services: law, marketing, consulting, recruitment, printing and security Grinding machines |
| UNSPSC |
| - |
| Regions |
| APEC Countries Asia Eastern Asia |
| Sectors |
| Automobiles and Auto Parts Supply Engineering Printing and Publishing Technology Hardware and Equipment Construction Energy-Power and Electrical Computer Hardwares and Consumables Electronics |
| Contractor |
| Contract Value |
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