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Contract Details
| Title |
Cmp Integrated Thickness Monitoring Systems China |
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|---|---|---|---|---|
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| Country | ||||
| Language | English | |||
| Organization | ||||
| Published Date | 11.07.2024 | |||
| Awarded Date | 12.08.2020 | |||
| Overview | Contract Award's Details : Cmp Integrated Thickness Monitoring Systems Ceiec Country: China Cmp Integrated Thickness Monitoring Systems Contract Awarded for Cmp integrated thickness monitoring systems Project Name: 12 inch wafer manufacturing fab Purchasers: Nexchip semiconductor corporation Open-Time of Bids: :2020-08-04 10:00 Data of Evaluation Result: :20200806 17:46 20200810 23:59 Data of Bidding Result: :2020-08-11 15:11 China Contract value : See in details Contractors : NOVA MEASURING INSTRUMENTS LTD. See in details 13/08/2020 11/11/2020 76622321 13/08/2020 Ceiec Country: China Address : China China Contract Awards China 0714-1640HFJH0001/260 See in details 11/11/2020 See in details | |||
| NAICS | ||||
| CPVS | ||||
| UNSPSC |
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China
| Title |
|---|
Cmp Integrated Thickness Monitoring Systems China |
| Country |
| Language |
| English |
| Organization |
| Published Date |
| 11.07.2024 |
| Awarded Date |
| 12.08.2020 |
| Overview |
| Contract Award's Details : Cmp Integrated Thickness Monitoring Systems Ceiec Country: China Cmp Integrated Thickness Monitoring Systems Contract Awarded for Cmp integrated thickness monitoring systems Project Name: 12 inch wafer manufacturing fab Purchasers: Nexchip semiconductor corporation Open-Time of Bids: :2020-08-04 10:00 Data of Evaluation Result: :20200806 17:46 20200810 23:59 Data of Bidding Result: :2020-08-11 15:11 China Contract value : See in details Contractors : NOVA MEASURING INSTRUMENTS LTD. See in details 13/08/2020 11/11/2020 76622321 13/08/2020 Ceiec Country: China Address : China China Contract Awards China 0714-1640HFJH0001/260 See in details 11/11/2020 See in details |
| NAICS |
| Navigational Measuring Navigational |
| CPVS |
| System, storage and content management software package Measuring instruments System, storage and content management software development services Semiconductors |
| UNSPSC |
| - |
| Regions |
| APEC Countries Asia Eastern Asia |
| Sectors |
| Automobiles and Auto Parts Supply Printing and Publishing Construction Energy-Power and Electrical Computer Hardwares and Consumables |
| Contractor |
| Contract Value |
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