Contract Details
Title

Double Sided Lithography And Wafer Bonding Machine 1set China

Country
Language
English
Organization
Published Date
11.07.2024
Awarded Date
17.08.2020
Overview
Contract Award's Details : Double Sided Lithography And Wafer Bonding Machine 1set Ningbo International Tendering Co.,Ltd. Country: China Double Sided Lithography And Wafer Bonding Machine 1set Contract Awarded for Double sided lithography and wafer bonding machine 1set Project Name: Purchase of double-sided lithography and wafer bonding machine by ningbo research institute of northwest polytechnic university Purchasers: Ningbo institute of northwest university of technology Open-Time of Bids: :2020-08-05 14:00 Data of Evaluation Result: :20200807 11:29 20200810 23:59 Data of Bidding Result: :2020-08-15 00:15 China Contract value : See in details Contractors : SUSS MICROTEC LITHOGRAPHY GMBH See in details 18/08/2020 15/11/2020 76641866 18/08/2020 Ningbo International Tendering Co.,Ltd. Country: China Address : China China Contract Awards China 0655-2040NIT3016N See in details 15/11/2020 See in details
NAICS
Colleges Colleges International Colleges
CPVS
Research, testing and scientific technical simulator
UNSPSC
Awards Machine made parts Double room University
Regions
APEC Countries Asia Eastern Asia
Sectors
Automobiles and Auto Parts Supply Printing and Publishing Technology Hardware and Equipment Construction Energy-Power and Electrical Computer Hardwares and Consumables Marine
Contractor
Contract Value
See in details
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