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Contract Details
Title |
Chip To Plate Bonding Equipment (france-grenoble: Microelectronic Machinery And Apparatus) France |
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Country | ||||
Language | English | |||
Organization | ||||
Published Date | 06.02.2024 | |||
Awarded Date | 07.10.2020 | |||
Overview | Contract Award's Details : Chip To Plate Bonding Equipment (france-grenoble: Microelectronic Machinery And Apparatus) Official name: CEA / Grenoble Postal address: 17 rue des Martyrs Town: Grenoble Cedex 9 NUTS code: FRK24 Isre Postal code: 38054 Country: France Contact person: Mme Charlotte Guerry E-mail: charlotte.guerry@cea.fr Telephone: + 33 438781938 Chip To Plate Bonding Equipment (france-grenoble: Microelectronic Machinery And Apparatus) Contract award notice: Chip to plate bonding equipment (france-grenoble: Microelectronic machinery and apparatus) This call for tenders concerns die-to-wafer direct bonding equipment for 3D microelectronic applications. Placement accuracy of less than 1 m with a throughput of at least 150 chips / hr is expected. Direct binding is a spontaneous assembly process at room temperature and atmospheric pressure, very sensitive to particulate contamination. Therefore, extremely low particulate contamination during die handling and mechanical movements is also required. Number of tenders received: 1 Other activity: Recherche France Contract value : See in details Contractors : SET CORPORATION SA See in details 08/10/2020 06/01/2021 76744952 08/10/2020 Official name: CEA / Grenoble Postal address: 17 rue des Martyrs Town: Grenoble Cedex 9 NUTS code: FRK24 Isre Postal code: 38054 Country: France Contact person: Mme Charlotte Guerry E-mail: charlotte.guerry@cea.fr Telephone: + 33 438781938 Address : France Contract Awards France 468706-2020 See in details 06/01/2021 See in details | |||
NAICS | ||||
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UNSPSC |
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Regions | ||||
Sectors |
Automobiles and Auto Parts
Non-Renewable Energy
Supply
Postal and Courier Services
Roads and Highways-Bridge
Cement and Asbestos Products
Railways-Rail-Railroad
Machinery and Equipments-M&E
Defence and Security
Construction
Energy-Power and Electrical
Computer Hardwares and Consumables
Steel
Electronics
Construction Materials
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Contractor | ||||
Contract Value |
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Title |
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Chip To Plate Bonding Equipment (france-grenoble: Microelectronic Machinery And Apparatus) France |
Country |
Language |
English |
Organization |
Published Date |
06.02.2024 |
Awarded Date |
07.10.2020 |
Overview |
Contract Award's Details : Chip To Plate Bonding Equipment (france-grenoble: Microelectronic Machinery And Apparatus) Official name: CEA / Grenoble Postal address: 17 rue des Martyrs Town: Grenoble Cedex 9 NUTS code: FRK24 Isre Postal code: 38054 Country: France Contact person: Mme Charlotte Guerry E-mail: charlotte.guerry@cea.fr Telephone: + 33 438781938 Chip To Plate Bonding Equipment (france-grenoble: Microelectronic Machinery And Apparatus) Contract award notice: Chip to plate bonding equipment (france-grenoble: Microelectronic machinery and apparatus) This call for tenders concerns die-to-wafer direct bonding equipment for 3D microelectronic applications. Placement accuracy of less than 1 m with a throughput of at least 150 chips / hr is expected. Direct binding is a spontaneous assembly process at room temperature and atmospheric pressure, very sensitive to particulate contamination. Therefore, extremely low particulate contamination during die handling and mechanical movements is also required. Number of tenders received: 1 Other activity: Recherche France Contract value : See in details Contractors : SET CORPORATION SA See in details 08/10/2020 06/01/2021 76744952 08/10/2020 Official name: CEA / Grenoble Postal address: 17 rue des Martyrs Town: Grenoble Cedex 9 NUTS code: FRK24 Isre Postal code: 38054 Country: France Contact person: Mme Charlotte Guerry E-mail: charlotte.guerry@cea.fr Telephone: + 33 438781938 Address : France Contract Awards France 468706-2020 See in details 06/01/2021 See in details |
NAICS |
Bolt Aluminum Sheet Turned Product and Screw Machinery Photographic Film Machine Shops; Turned Product; and Screw Electroplating Process |
CPVS |
Plates Bindings Nuts Microelectronic machinery and apparatus Lifting, handling, loading or unloading machinery Postal orders Plates, sheets, strip and foil related to construction materials |
UNSPSC |
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Regions |
Europe Western Europe |
Sectors |
Automobiles and Auto Parts Non-Renewable Energy Supply Postal and Courier Services Roads and Highways-Bridge Cement and Asbestos Products Railways-Rail-Railroad Machinery and Equipments-M&E Defence and Security Construction Energy-Power and Electrical Computer Hardwares and Consumables Steel Electronics Construction Materials |
Contractor |
Contract Value |
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