Contract Details
Title

Module Dispenser & Module Pcb Bonding & Module Lead Cleaner & Module Bonding Inspection China

Country
Language
English
Organization
Published Date
10.07.2024
Awarded Date
19.02.2019
Overview
Contract Award's Details : Module Dispenser & Module Pcb Bonding & Module Lead Cleaner & Module Bonding Inspection Ceiec Country: China Module Dispenser & Module Pcb Bonding & Module Lead Cleaner & Module Bonding Inspection Contract Awarded for Module dispenser & Module pcb bonding & Module lead cleaner & Module bonding inspection Project Name: Equipment procurement project of hkc g8.6 tft-lcd Purchasers: Chuzhou hkc optoelectronics technology co., Ltd. Open-Time of Bids: :2019-02-12 10:00 Data of Evaluation Result: :20190213 16:37 20190218 23:59 Data of Bidding Result: :2019-02-19 14:19 China Contract value : See in details Contractors : SOLUTION ADVANCED TECHNOLOGY CO.,LTD See in details 20/02/2019 19/05/2019 12890501 20/02/2019 Ceiec Country: China Address : China China Contract Awards China 0714-184CZHKC0001/119 See in details 19/05/2019 See in details
NAICS
Copper Machinery Copper
CPVS
Iron, lead, zinc, tin and copper Lead Modules Dispensers
UNSPSC
-
Regions
APEC Countries Asia Eastern Asia
Sectors
Automobiles and Auto Parts Supply Printing and Publishing Technology Hardware and Equipment Construction Energy-Power and Electrical Computer Hardwares and Consumables Electronics
Contractor
Contract Value
See in details
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