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Contract Details
| Title |
Plan To Purchase One Set Of Double Side Grinding Machine And Equipment Installation And Commissioning. China |
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| Country | ||||
| Language | English | |||
| Organization | ||||
| Published Date | 09.07.2024 | |||
| Awarded Date | 03.08.2018 | |||
| Overview | Contract Award's Details : Plan To Purchase One Set Of Double Side Grinding Machine And Equipment Installation And Commissioning. Tianjin Fanya Engineering Mechanic &Electronic Facilities Consulting Co.,Ltd Country: China Plan To Purchase One Set Of Double Side Grinding Machine And Equipment Installation And Commissioning. Contract Awarded for Plan to purchase one set of double side grinding machine and equipment installation and commissioning. Project Name: Integrated circuit with 8-12 inch semiconductor silicon wafer project phase third equipment procurement sixth package Purchasers: Zhonghuan advanced semiconductor materials co.,ltd. Open-Time of Bids: :2018-07-12 09:30 Data of Evaluation Result: :20180716 14:28 20180719 23:59 Data of Bidding Result: :2018-07-31 15:31 China Contract value : See in details Contractors : MICRO ENGINEERING INC. See in details 04/08/2018 31/10/2018 11346078 04/08/2018 Tianjin Fanya Engineering Mechanic &Electronic Facilities Consulting Co.,Ltd Country: China Address : China China Contract Awards China 0682-184201802031 See in details 31/10/2018 See in details | |||
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| CPVS | ||||
| UNSPSC | ||||
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| Contract Value |
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China
| Title |
|---|
Plan To Purchase One Set Of Double Side Grinding Machine And Equipment Installation And Commissioning. China |
| Country |
| Language |
| English |
| Organization |
| Published Date |
| 09.07.2024 |
| Awarded Date |
| 03.08.2018 |
| Overview |
| Contract Award's Details : Plan To Purchase One Set Of Double Side Grinding Machine And Equipment Installation And Commissioning. Tianjin Fanya Engineering Mechanic &Electronic Facilities Consulting Co.,Ltd Country: China Plan To Purchase One Set Of Double Side Grinding Machine And Equipment Installation And Commissioning. Contract Awarded for Plan to purchase one set of double side grinding machine and equipment installation and commissioning. Project Name: Integrated circuit with 8-12 inch semiconductor silicon wafer project phase third equipment procurement sixth package Purchasers: Zhonghuan advanced semiconductor materials co.,ltd. Open-Time of Bids: :2018-07-12 09:30 Data of Evaluation Result: :20180716 14:28 20180719 23:59 Data of Bidding Result: :2018-07-31 15:31 China Contract value : See in details Contractors : MICRO ENGINEERING INC. See in details 04/08/2018 31/10/2018 11346078 04/08/2018 Tianjin Fanya Engineering Mechanic &Electronic Facilities Consulting Co.,Ltd Country: China Address : China China Contract Awards China 0682-184201802031 See in details 31/10/2018 See in details |
| NAICS |
| Architectural Machinery Research and Development in the Physical Research and Development in the Physical |
| CPVS |
| Engineering, auxiliary, average, loss, actuarial and salvage insurance services Business services: law, marketing, consulting, recruitment, printing and security Semiconductors Grinding machines Electronic, electromechanical and electrotechnical supplies |
| UNSPSC |
| Integrated circuits Awards Well engineering Machine made parts Equipment cases Double room |
| Regions |
| APEC Countries Asia Eastern Asia |
| Sectors |
| Automobiles and Auto Parts Supply Engineering Roads and Highways-Bridge Printing and Publishing Construction Energy-Power and Electrical Computer Hardwares and Consumables Steel Electronics |
| Contractor |
| Contract Value |
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