Contract Details
Title

Backside Taiko Grinding 1setbackside Grinding 1set Ring Cutter 1 Set China

Country
Language
English
Organization
Published Date
10.07.2024
Awarded Date
09.05.2019
Overview
Contract Award's Details : Backside Taiko Grinding 1setbackside Grinding 1set Ring Cutter 1 Set Shanghai Machinery & Electric Equipment Tendering Co.Ltd Country: China Backside Taiko Grinding 1setbackside Grinding 1set Ring Cutter 1 Set Contract Awarded for Backside taiko grinding 1set backside grinding 1set ring cutter 1 set Project Name: Grinding&ring cutter Purchasers: Semiconductor manufacturing electronics (shaoxing) corporation Open-Time of Bids: :2019-05-05 09:30 Data of Evaluation Result: :20190505 16:46 20190508 23:59 Data of Bidding Result: :2019-05-10 15:10 China Contract value : See in details Contractors : DISCO HI-TEC (CHINA) CO., LTD. See in details 10/05/2019 10/08/2019 13248999 10/05/2019 Shanghai Machinery & Electric Equipment Tendering Co.Ltd Country: China Address : China China Contract Awards China 0613-194022151086/01 See in details 10/08/2019 See in details
NAICS
Regulation and Administration of Communications Furniture Machinery Regulation and Administration of Communications
CPVS
Semiconductors Rings, seals, bands, sticks and grout packers
UNSPSC
-
Regions
APEC Countries Asia Eastern Asia
Sectors
Automobiles and Auto Parts Supply Machinery and Equipments-M&E Electricity Construction Energy-Power and Electrical Computer Hardwares and Consumables Electronics
Contractor
Contract Value
See in details
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