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Contract Details
Title |
Plan To Purchase 3 Sets Of 32b Double Side Lapping Machine And Equipment Installation And Commissioning. China |
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Language | English | |||
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Published Date | 09.07.2024 | |||
Awarded Date | 02.10.2017 | |||
Overview | Contract Award's Details : Plan To Purchase 3 Sets Of 32b Double Side Lapping Machine And Equipment Installation And Commissioning. Tianjin Fanya Engineering Mechanic &Electronic Facilities Consulting Co.,Ltd Country: China Plan To Purchase 3 Sets Of 32b Double Side Lapping Machine And Equipment Installation And Commissioning. Contract Awarded for Plan to purchase 3 sets of 32b double side lapping machine and equipment installation and commissioning. Project Name: 8 inch semiconductor silicon wafer and dw slice project equipment purchase the first batch of the first package 32b double side lapping machine Purchasers: Tianjin huanou semiconductor material and technology co.,ltd Open-Time of Bids: :2017-09-22 09:30 Data of Evaluation Result: :20170925 18:03 20170928 23:59 Data of Bidding Result: :2017-09-29 12:29 China Contract value : See in details Contractors : NIPPON STEEL&SUMIKIN BUSSAN MATEX CO.,LTD See in details 03/10/2017 29/12/2017 9511675 03/10/2017 Tianjin Fanya Engineering Mechanic &Electronic Facilities Consulting Co.,Ltd Country: China Address : China China Contract Awards China 0682-174201722016 See in details 29/12/2017 See in details | |||
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Title |
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Plan To Purchase 3 Sets Of 32b Double Side Lapping Machine And Equipment Installation And Commissioning. China |
Country |
Language |
English |
Organization |
Published Date |
09.07.2024 |
Awarded Date |
02.10.2017 |
Overview |
Contract Award's Details : Plan To Purchase 3 Sets Of 32b Double Side Lapping Machine And Equipment Installation And Commissioning. Tianjin Fanya Engineering Mechanic &Electronic Facilities Consulting Co.,Ltd Country: China Plan To Purchase 3 Sets Of 32b Double Side Lapping Machine And Equipment Installation And Commissioning. Contract Awarded for Plan to purchase 3 sets of 32b double side lapping machine and equipment installation and commissioning. Project Name: 8 inch semiconductor silicon wafer and dw slice project equipment purchase the first batch of the first package 32b double side lapping machine Purchasers: Tianjin huanou semiconductor material and technology co.,ltd Open-Time of Bids: :2017-09-22 09:30 Data of Evaluation Result: :20170925 18:03 20170928 23:59 Data of Bidding Result: :2017-09-29 12:29 China Contract value : See in details Contractors : NIPPON STEEL&SUMIKIN BUSSAN MATEX CO.,LTD See in details 03/10/2017 29/12/2017 9511675 03/10/2017 Tianjin Fanya Engineering Mechanic &Electronic Facilities Consulting Co.,Ltd Country: China Address : China China Contract Awards China 0682-174201722016 See in details 29/12/2017 See in details |
NAICS |
Architectural Machinery Research and Development in the Physical Research and Development in the Physical |
CPVS |
Engineering, auxiliary, average, loss, actuarial and salvage insurance services Business services: law, marketing, consulting, recruitment, printing and security Semiconductors Electronic, electromechanical and electrotechnical supplies |
UNSPSC |
Awards Well engineering Machine made parts Equipment cases Double room |
Regions |
APEC Countries Asia Eastern Asia |
Sectors |
Automobiles and Auto Parts Supply Engineering Roads and Highways-Bridge Printing and Publishing Technology Hardware and Equipment Construction Agriculture-Food and Beverages Energy-Power and Electrical Computer Hardwares and Consumables Steel Electronics |
Contractor |
Contract Value |
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