Contract Details
Title

Poly Etch 1setwh_dsp 3sets China

Country
Language
English
Organization
Published Date
11.07.2024
Awarded Date
16.10.2020
Overview
Contract Award's Details : Poly Etch 1setwh_dsp 3sets Shanghai Machinery & Electric Equipment Tendering Co.Ltd Country: China Poly Etch 1setwh_dsp 3sets Contract Awarded for Poly etch 1set wh_dsp 3sets Project Name: Hefei jinghe 12-inch wafer manufacturing base project poly etch and wh_dsp Purchasers: Nexchip semiconductor corporation Open-Time of Bids: :2020-10-12 10:00 Data of Evaluation Result: :20201012 20:34 20201015 23:59 Data of Bidding Result: :2020-10-16 11:16 China Contract value : See in details Contractors : LAM RESEARCH INTERNATIONAL SARL See in details 17/10/2020 16/01/2021 76778619 17/10/2020 Shanghai Machinery & Electric Equipment Tendering Co.Ltd Country: China Address : China China Contract Awards China 0613-204025073387 See in details 16/01/2021 See in details
NAICS
Regulation and Administration of Communications Machinery Regulation and Administration of Communications International
CPVS
Research, testing and scientific technical simulator Semiconductors
UNSPSC
-
Regions
APEC Countries Asia Eastern Asia
Sectors
Automobiles and Auto Parts Supply Infrastructure Machinery and Equipments-M&E Electricity Construction Energy-Power and Electrical Computer Hardwares and Consumables
Contractor
Contract Value
See in details
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