Sign up now with your company or organization email and enjoy a
1-week free trial!
Contract Awards
Total
21
contracts found.
21
contracts are listing.
Advanced Filters
Mpw Service\\ntechnology Type : Ams Ac18, 0.18um Die Size Area : 3.4mm X 3.7mm (12.58mm)\\nprovided...
Organization:
*****
Language:
English
Country:
Singapore
Deadline:
06.07.2018
Analog/mixed Signal Ic Design Tools Educational Bundle Software From 1 Jan 2018 Till 31 Dec 2018 Wit...
Organization:
*****
Language:
English
Country:
Singapore
Deadline:
17.08.2017
To Provide Mpw Service In Semiconductor Foundry For Ic Chip Fabrication 1) Ams C35b4o1-0.35um Cmos-o...
Organization:
*****
Language:
English
Country:
Singapore
Deadline:
07.03.2017
Ic Chip Packaging Service: To Provide Dicing, Wire Bonding And Packaging Of 15 Samples For 5 Dices....
Organization:
*****
Language:
English
Country:
Singapore
Deadline:
24.01.2017
Supply & Delivery Of Turnkey Service For Integrated Circuit (ic) Packaging (including Bonding & Pack...
Organization:
*****
Language:
English
Country:
Singapore
Deadline:
02.12.2016
19x7x0.25mm Ain Heatsink (refer To The Attached Specifications) Singapore
Organization:
*****
Language:
English
Country:
Singapore
Deadline:
17.11.2016
Provide Ic Fabrication Foundry Service For Ams C18 Mpw;- Based On 12.55 Square Mm Usage With 40 Dies...
Organization:
*****
Language:
English
Country:
Singapore
Deadline:
07.10.2016
To Provide Dicing, Wire Bonding And Packaging Of Prototypes Dies And 48l Mlp Sockets Singapore
Organization:
*****
Language:
English
Country:
Singapore
Deadline:
27.09.2016
Software License From 1 Jan 2017 Till 31 Dec 2017 (previously Called Zeni)aether Software Educationa...
Organization:
*****
Language:
English
Country:
Singapore
Deadline:
16.08.2016
Provide ic fabrication foundry service for ams c18 mpw;- based on 4.5 x 3 square mm usage with 40 di...
Organization:
*****
Language:
English
Country:
Singapore
Deadline:
14.03.2016
Supply and delivery of high-speed pcb design, fabrication, wirebonding and assembly Singapore
Organization:
*****
Language:
English
Country:
Singapore
Deadline:
09.03.2016
Provide individual die dicing of 15 tiles per c18 dicing diagram. 4 die types (die a to d) per tile...
Organization:
*****
Language:
English
Country:
Singapore
Deadline:
14.02.2016
Wiring bonding and sub dicing service; provide material and assembly service (please refer to the at...
Organization:
*****
Language:
English
Country:
Singapore
Deadline:
28.09.2015
Supply and delivery of integrated circuit (ic) packaging Singapore
Organization:
*****
Language:
English
Country:
Singapore
Deadline:
23.04.2015