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Title:
IC Packaging Fair 2025
Country:
China
City:
Shenzhen
Start Date:
27.10.2025
End Date:
29.10.2025
Venue:
Shenzhen World Exhibition & Convention Center (Baoan)
Items to be Exhibited:
1. Semiconductor Packaging equipment: - Die Bonder/Mounting Machine - Wire Bonding Machine - Formic Acid Reflow Oven- Sintering Furnace - Aluminum/Copper Wire Bonding Machine - Dispensing Equipment/Potting Machine - Plastic Encapsulation Machine / Molding Machine - Pin Insertion Machine - Ultrasonic Scanning/Inspection - Eutectic Bonding Machine - Flip Chip Mounting Machine / Flip Chip Bonder - Etching Machine - Photolithography Machine / Lithography Machine - Exposure and Development Machine 2. Peripheral Equipment\Test Equipment\Materials Wafer Thinning and Dicing Machine Tape and Reel Equipment / Tape and Reel Assembler Triple-Light AOI (Automated Optical Inspection) Functional Test Equipment Plating Equipment Ball Mounting Machine for Packaging Trim and Form Machine Push-Pull Tester Silver Paste Thermal Components Ceramic Substrate Aluminum Wire / Copper Wire / Gold Wire Cleaning Agent / Cleanser Photoresist
For Visitors:
Eligibility : Trade only Method of admission : Free / Apply/register online For details, please contact the organizer directly.
Organizer:
RX Greater China Address : 42F, Intercontinental Center, 100 Yutong Road, Jingan District,Shanghai 200070, P.R.China Person : Walden Li Tel : +86-136-5125-1335 E-mail : [email protected]
Frequency:
Annual
Last Fair Information:
IC Packaging Fair 2025 October 28, 2025 - October 30, 2025 Shenzhen / China / Asia Shenzhen World Exhibition & Convention Center (Baoan) 1. Semiconductor Packaging equipment: - Die Bonder/Mounting Machine - Wire Bonding Machine - Formic Acid Reflow Oven- Sintering Furnace - Aluminum/Copper Wire Bonding Machine - Dispensing Equipment/Potting Machine - Plastic Encapsulation Machine / Molding Machine - Pin Insertion Machine - Ultrasonic Scanning/Inspection - Eutectic Bonding Machine - Flip Chip Mounting Machine / Flip Chip Bonder - Etching Machine - Photolithography Machine / Lithography Machine - Exposure and Development Machine 2. Peripheral Equipment\\Test Equipment\\Materials Wafer Thinning and Dicing Machine Tape and Reel Equipment / Tape and Reel Assembler Triple-Light AOI (Automated Optical Inspection) Functional Test Equipment Plating Equipment Ball Mounting Machine for Packaging Trim and Form Machine Push-Pull Tester Silver Paste Thermal Components Ceramic Substrate Aluminum Wire / Copper Wire / Gold Wire Cleaning Agent / Cleanser Photoresist Eligibility : Trade only Method of admission : Free / Apply/register online For details, please contact the organizer directly. RX Greater China Address : 42F, Intercontinental Center, 100 Yutong Road, Jingan District,Shanghai 200070, P.R.China Person : Walden Li Tel : +86-136-5125-1335 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website:
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Regions:
APEC Countries Asia Eastern Asia
Industries:
Machinery Industrial Technology ／Electric & Electronics (Products Machinery) Machinery Industrial Technology ／Testing Measuring & Analyzing Precision Mechanics Machinery Industrial Technology ／Material Handling Pneumatics Machinery Industrial Technology ／Manufacturing Technology & Engineering Industrial Technology ／Machine Tools Metalworking Machinery
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