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Title:
IC PACKAGING FAIR - IC Packaging Fair. Laminating technology and equipment, Soldering equipment, Test and measurement equipment, Laboratory test and measurement equipment, PCBA section test and measurement equipment, Finished product assembly section test and measurement...
Country:
China
City:
Shenzhen
Start Date:
01.01.1970
End Date:
26.10.2026
Venue:
Shenzhen World Exhibition & Convention Center No.1 Zhancheng Road Fuhai Street Bao’an District Shenzhen, Guangdong China +86 0755-32937926 http://www.shenzhen-world.com/en/index.html [email protected]
Items to be Exhibited:
For more details about this trade fair, please visit the following URL: http://www.shenzhen-world.com/en/index.html
For Visitors:
For more details about this trade fair, please visit the following URL: http://www.shenzhen-world.com/en/index.html
Organizer:
RX China 15th Floor, Tower A, Pingan International Finance Center No.1-3, Xinyuan South Road Chaoyang District Beijing 100027 China +86 10 5933 9000 +86 10 5933 9333 http://rxglobal.com/rx-china [email protected] RX Global Events Gateway House 28 The Quadrant Richmond, Surrey TW9 1DN UK - United Kingdom +44 20 8271 2134 +44 20 8910 7823 http://rxglobal.com [email protected]
Message from Organizer:
IC Packaging Fair. Laminating technology and equipment, Soldering equipment, Test and measurement equipment, Laboratory test and measurement equipment, PCBA section test and measurement equipment, Finished product assembly section test and measurement...
Frequency:
For more details about this trade fair, please visit the following URL: http://www.shenzhen-world.com/en/index.html
Last Fair Information:
For more details about this trade fair, please visit the following URL: http://www.shenzhen-world.com/en/index.html
Official Website:
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Regions:
APEC Countries Asia Eastern Asia
Industries:
Industry-Electronics - Electrotechnics
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