Total Solution Exhibition for Electronic Equipment 2024...

Online Trade Fair Details

Title	Total Solution Exhibition for Electronic Equipment 2024
Country	Japan
City	Tokyo
Regions	APEC Countries Asia Eastern Asia
Industries	Telecommunication ／Telecommunication Data Processing Machinery Industrial Technology ／Electric & Electronics (Products Machinery) Machinery Industrial Technology ／Manufacturing Technology & Engineering Machinery Industrial Technology ／Advanced Technology/Materials Composites R & D Information Computer Information Telecommunication ／Optics Optical Instruments Laser
Start Date	11.06.2024
End Date	13.06.2024
Venue	Tokyo Big Sight
Items to be Exhibited	Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc.
For Visitors	Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer	Japan Electronics Packaging and Circuits Association Tel : +81-3-5310-2020 E-mail : show@jpca.org
Message from Organizer	-
Frequency	Annual
Last Fair Information	Total Solution Exhibition for Electronic Equipment 2024 June 12, 2024 - June 14, 2024 Tokyo / Japan / Asia Tokyo Big Sight Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Electronics Packaging and Circuits Association Tel : +81-3-5310-2020 E-mail : show@jpca.org For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website	Official Website
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Title
Total Solution Exhibition for Electronic Equipment 2024
Country
Japan
City
Tokyo
Regions
APEC Countries Asia Eastern Asia
Industries
Telecommunication ／Telecommunication Data Processing Machinery Industrial Technology ／Electric & Electronics (Products Machinery) Machinery Industrial Technology ／Manufacturing Technology & Engineering Machinery Industrial Technology ／Advanced Technology/Materials Composites R & D Information Computer Information Telecommunication ／Optics Optical Instruments Laser
Start Date
11.06.2024
End Date
13.06.2024
Venue
Tokyo Big Sight
Items to be Exhibited
Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc.
For Visitors
Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer
Japan Electronics Packaging and Circuits Association Tel : +81-3-5310-2020 E-mail : show@jpca.org
Message from Organizer

Frequency
Annual
Last Fair Information
Total Solution Exhibition for Electronic Equipment 2024 June 12, 2024 - June 14, 2024 Tokyo / Japan / Asia Tokyo Big Sight Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Electronics Packaging and Circuits Association Tel : +81-3-5310-2020 E-mail : show@jpca.org For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website
Official Website
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