Online Trade Fair Details
Title

Total Solution Exhibition for Electronic Equipment 2024

Country
Japan
City
Tokyo
Regions
APEC Countries Asia Eastern Asia
Industries
Telecommunication /Telecommunication Data Processing Machinery Industrial Technology /Electric & Electronics (Products Machinery) Machinery Industrial Technology /Manufacturing Technology & Engineering Machinery Industrial Technology /Advanced Technology/Materials Composites R & D Information Computer Information Telecommunication /Optics Optical Instruments Laser
Start Date
11.06.2024
End Date
13.06.2024
Venue
Tokyo Big Sight
Items to be Exhibited
Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc.
For Visitors
Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer
Japan Electronics Packaging and Circuits Association Tel : +81-3-5310-2020 E-mail : [email protected]
Message from Organizer
Frequency
Annual
Last Fair Information
Total Solution Exhibition for Electronic Equipment 2024 June 12, 2024 - June 14, 2024 Tokyo / Japan / Asia Tokyo Big Sight Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Electronics Packaging and Circuits Association Tel : +81-3-5310-2020 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website
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