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Title:
JISSO PROTEC 2026
Country:
Japan
City:
Tokyo
Start Date:
09.06.2026
End Date:
11.06.2026
Venue:
Tokyo Big Sight
Items to be Exhibited:
Electronic component placement machine, electronic component insertion machine, cream solder printing machine, soldering device (reflow oven), dispenser, transport system, taping machine & material, bulk feeder & other feeder, automatic assembly device, wire bonder, die bonder, flip chip mounting system, LCD & COG bonding system, BGA & ILB system, COB system, board appearance inspection device, semiconductor manufacturing related inspection & measurement device, other mounting related inspection & measurement device, design tool, production optimization software, mounting programming device , SMD, semiconductor package parts, small electronic parts, chip parts, connectors & sockets, switches, bulk supply parts, taping reels, carrier tapes, TAB tapes & reels, magazine sticks, IC trays, bulk cases, soldering equipment, soldering & joining material, underfill material, high-frequency-enabled device & parts & material, environment-related equipment & material
For Visitors:
Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
Japan Robot Association (JARA)
Frequency:
Annual
Last Fair Information:
JISSO PROTEC 2026 June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight Electronic component placement machine, electronic component insertion machine, cream solder printing machine, soldering device (reflow oven), dispenser, transport system, taping machine & material, bulk feeder & other feeder, automatic assembly device, wire bonder, die bonder, flip chip mounting system, LCD & COG bonding system, BGA & ILB system, COB system, board appearance inspection device, semiconductor manufacturing related inspection & measurement device, other mounting related inspection & measurement device, design tool, production optimization software, mounting programming device , SMD, semiconductor package parts, small electronic parts, chip parts, connectors & sockets, switches, bulk supply parts, taping reels, carrier tapes, TAB tapes & reels, magazine sticks, IC trays, bulk cases, soldering equipment, soldering & joining material, underfill material, high-frequency-enabled device & parts & material, environment-related equipment & material Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. Japan Robot Association (JARA) For more detailed information of the trade fair, please check the official website of the individual organizer.
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Regions:
APEC Countries Asia Eastern Asia
Industries:
Machinery Industrial Technology ／Electric & Electronics (Products Industrial Technology ／Testing Measuring & Analyzing Precision Mechanics Machinery Waste Disposal Recycling Industrial Technology ／Manufacturing Technology & Engineering Machinery Machinery) Environment／Environmental Protection
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