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Online Trade Fair Details
Title

2025 Microelectronics Show

Country
Japan
City
Tokyo
Regions
APEC Countries Asia Eastern Asia
Industries
Machinery Industrial Technology ／Electric & Electronics (Products Machinery) Machinery Industrial Technology ／Testing Measuring & Analyzing Precision Mechanics Machinery Industrial Technology ／Advanced Technology/Materials Composites R & D Machinery Industrial Technology ／Manufacturing Technology & Engineering
Start Date
03.06.2025
End Date
05.06.2025
Venue
Tokyo Big Sight
Items to be Exhibited
High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc.
For Visitors
Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer
JIEP
Message from Organizer
Frequency
Annual
Last Fair Information
2025 Microelectronics Show June 4, 2025 - June 6, 2025 Tokyo / Japan / Asia Tokyo Big Sight High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. JIEP For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website
Official Website
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