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Online Trade Fair Details
Title:
2025 Microelectronics Show
Country:
City:
Tokyo
Start Date:
03.06.2025
End Date:
05.06.2025
Venue:
Tokyo Big Sight
Items to be Exhibited:
High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc.
For Visitors:
Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
JIEP
Frequency:
Annual
Last Fair Information:
2025 Microelectronics Show June 4, 2025 - June 6, 2025 Tokyo / Japan / Asia Tokyo Big Sight High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. JIEP For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website:
Regions:
Industries:
Machinery
Industrial Technology /Electric & Electronics (Products
Machinery) Machinery
Industrial Technology /Testing
Measuring & Analyzing
Precision Mechanics Machinery
Industrial Technology /Advanced Technology/Materials
Composites
R & D Machinery
Industrial Technology /Manufacturing Technology & Engineering
Online Trade Fair Details
| Title |
2025 Microelectronics Show |
|||
|---|---|---|---|---|
3 Month Special Offer — Get 1 Month FreePay for 2 months, use 3 months. Unlimited premium access. |
||||
| Country | ||||
| City | Tokyo | |||
| Regions | APEC Countries Asia Eastern Asia | |||
| Industries | Machinery Industrial Technology /Electric & Electronics (Products Machinery) Machinery Industrial Technology /Testing Measuring & Analyzing Precision Mechanics Machinery Industrial Technology /Advanced Technology/Materials Composites R & D Machinery Industrial Technology /Manufacturing Technology & Engineering | |||
| Start Date | 03.06.2025 | |||
| End Date | 05.06.2025 | |||
| Venue | Tokyo Big Sight | |||
| Items to be Exhibited | High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. | |||
| For Visitors | Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. | |||
| Organizer | JIEP | |||
| Message from Organizer | - | |||
| Frequency | Annual | |||
| Last Fair Information | 2025 Microelectronics Show June 4, 2025 - June 6, 2025 Tokyo / Japan / Asia Tokyo Big Sight High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. JIEP For more detailed information of the trade fair, please check the official website of the individual organizer. | |||
| Official Website | Official Website | |||
| Share | ||||
| Title |
|---|
2025 Microelectronics Show |
| Country |
| City |
| Tokyo |
| Regions |
| Industries |
|
Machinery
Industrial Technology /Electric & Electronics (Products
Machinery) Machinery
Industrial Technology /Testing
Measuring & Analyzing
Precision Mechanics Machinery
Industrial Technology /Advanced Technology/Materials
Composites
R & D Machinery
Industrial Technology /Manufacturing Technology & Engineering
|
| Start Date |
| 03.06.2025 |
| End Date |
| 05.06.2025 |
| Venue |
| Tokyo Big Sight |
| Items to be Exhibited |
| High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. |
| For Visitors |
| Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
| JIEP |
| Message from Organizer |
| Frequency |
| Annual |
| Last Fair Information |
| 2025 Microelectronics Show June 4, 2025 - June 6, 2025 Tokyo / Japan / Asia Tokyo Big Sight High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. JIEP For more detailed information of the trade fair, please check the official website of the individual organizer. |
| Official Website |
| Visit Official Website |
| Share |
Tenders from United States of America
WPCA Bid - Procurement of Semi-positive Displacement Grinder Pumps for the Perna Lane Project City of Stamford Purchasing Department
Organization:
***************
Country:
United States of America
Deadline:
14.07.2026
City Bid - Yerwood Center Interior Renovations City of Stamford Purchasing Department
Organization:
***************
Country:
United States of America
Deadline:
14.07.2026
Airside Development - GON Connecticut Airport Authority (CAA)
Organization:
***************
Country:
United States of America
Deadline:
15.07.2026
On-**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
15.07.2026
KEE**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
15.07.2026
On **************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
15.07.2026
Sho**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
15.07.2026
Cit**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
16.07.2026
Por**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
16.07.2026
Cit**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
20.07.2026
Cit**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
21.07.2026
Int**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
22.07.2026
Day**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
23.07.2026
202**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
23.07.2026
BAL**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
30.07.2026
Cit**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
30.07.2026
Cit**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
30.07.2026
Cit**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
30.07.2026
CSA**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
04.08.2026
Mar**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
12.08.2026
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