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Online Trade Fair Details
Title:
NEPCON JAPAN 2026
Country:
City:
Tokyo
Start Date:
20.01.2026
End Date:
22.01.2026
Venue:
Tokyo Big Sight
Items to be Exhibited:
SMT, Testing Technologies, Technologies for IC & Sensor Packaging, Electronic Components & Materials, Printed Circuit Boards, Fine Process Technologies, etc.
For Visitors:
Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
RX Japan Ltd. Tel : +81-3-6739-4102 E-mail : [email protected]
Frequency:
Annual
Last Fair Information:
NEPCON JAPAN 2026 January 21, 2026 - January 23, 2026 Tokyo / Japan / Asia Tokyo Big Sight SMT, Testing Technologies, Technologies for IC & Sensor Packaging, Electronic Components & Materials, Printed Circuit Boards, Fine Process Technologies, etc. Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. RX Japan Ltd. Tel : +81-3-6739-4102 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website:
Regions:
Industries:
Machinery)
Logistics
Packaging /Automobiles(incl. Parts
Machinery
Industrial Technology /Electric & Electronics (Products
Machinery) Machinery
Industrial Technology /Testing
Measuring & Analyzing
Precision Mechanics Machinery
Industrial Technology /Material Handling
Pneumatics Machinery
Industrial Technology /Machine Tools
Metalworking Machinery
Industrial Technology /Manufacturing Technology & Engineering Transportation
Online Trade Fair Details
| Title |
NEPCON JAPAN 2026 |
|||
|---|---|---|---|---|
3 Month Special Offer — Get 1 Month FreePay for 2 months, use 3 months. Unlimited premium access. |
||||
| Country | ||||
| City | Tokyo | |||
| Regions | APEC Countries Asia Eastern Asia | |||
| Industries | Machinery) Logistics Packaging /Automobiles(incl. Parts Machinery Industrial Technology /Electric & Electronics (Products Machinery) Machinery Industrial Technology /Testing Measuring & Analyzing Precision Mechanics Machinery Industrial Technology /Material Handling Pneumatics Machinery Industrial Technology /Machine Tools Metalworking Machinery Industrial Technology /Manufacturing Technology & Engineering Transportation | |||
| Start Date | 20.01.2026 | |||
| End Date | 22.01.2026 | |||
| Venue | Tokyo Big Sight | |||
| Items to be Exhibited | SMT, Testing Technologies, Technologies for IC & Sensor Packaging, Electronic Components & Materials, Printed Circuit Boards, Fine Process Technologies, etc. | |||
| For Visitors | Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. | |||
| Organizer | RX Japan Ltd. Tel : +81-3-6739-4102 E-mail : [email protected] | |||
| Message from Organizer | - | |||
| Frequency | Annual | |||
| Last Fair Information | NEPCON JAPAN 2026 January 21, 2026 - January 23, 2026 Tokyo / Japan / Asia Tokyo Big Sight SMT, Testing Technologies, Technologies for IC & Sensor Packaging, Electronic Components & Materials, Printed Circuit Boards, Fine Process Technologies, etc. Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. RX Japan Ltd. Tel : +81-3-6739-4102 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer. | |||
| Official Website | Official Website | |||
| Share | ||||
| Title |
|---|
NEPCON JAPAN 2026 |
| Country |
| City |
| Tokyo |
| Regions |
| Industries |
|
Machinery)
Logistics
Packaging /Automobiles(incl. Parts
Machinery
Industrial Technology /Electric & Electronics (Products
Machinery) Machinery
Industrial Technology /Testing
Measuring & Analyzing
Precision Mechanics Machinery
Industrial Technology /Material Handling
Pneumatics Machinery
Industrial Technology /Machine Tools
Metalworking Machinery
Industrial Technology /Manufacturing Technology & Engineering Transportation
|
| Start Date |
| 20.01.2026 |
| End Date |
| 22.01.2026 |
| Venue |
| Tokyo Big Sight |
| Items to be Exhibited |
| SMT, Testing Technologies, Technologies for IC & Sensor Packaging, Electronic Components & Materials, Printed Circuit Boards, Fine Process Technologies, etc. |
| For Visitors |
| Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
| RX Japan Ltd. Tel : +81-3-6739-4102 E-mail : [email protected] |
| Message from Organizer |
| Frequency |
| Annual |
| Last Fair Information |
| NEPCON JAPAN 2026 January 21, 2026 - January 23, 2026 Tokyo / Japan / Asia Tokyo Big Sight SMT, Testing Technologies, Technologies for IC & Sensor Packaging, Electronic Components & Materials, Printed Circuit Boards, Fine Process Technologies, etc. Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. RX Japan Ltd. Tel : +81-3-6739-4102 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer. |
| Official Website |
| Visit Official Website |
| Share |
Tenders from United States of America
Invitation for Bid - Fire Alarm System District of Columbia Office of Contracting and Procurement (DC OCP)
Organization:
***************
Country:
United States of America
Deadline:
06.07.2026
FY26-OCME-RFQ-BPA for Autopsy Sink Service-Open Market District of Columbia Office of Contracting and Procurement (DC OCP)
Organization:
***************
Country:
United States of America
Deadline:
08.07.2026
Asset Management Key System District of Columbia Office of Contracting and Procurement (DC OCP)
Organization:
***************
Country:
United States of America
Deadline:
15.07.2026
27-**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
15.07.2026
26_**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
15.07.2026
Bro**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
15.07.2026
Mal**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
16.07.2026
202**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
21.07.2026
Cit**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
22.07.2026
Ada**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
22.07.2026
27-**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
22.07.2026
202**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
23.07.2026
\ 0**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
28.07.2026
202**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
30.07.2026
Ska**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
31.07.2026
Ska**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
31.07.2026
Ska**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
01.08.2026
SE **************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
06.08.2026
Req**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
11.08.2026
609**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
12.08.2026



