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Online Trade Fair Details
Title:
Electronics Component & Unit Show 2026
Country:
City:
Tokyo
Start Date:
09.06.2026
End Date:
11.06.2026
Venue:
Tokyo Big Sight
Items to be Exhibited:
General solution technologies using semiconductors and electronic components (semiconductors, electronic devices, sensors, mechanical components, FA control equipment, measuring instruments, power supplies, IoT and M2M solutions, manufacturing solutions and systems)
For Visitors:
Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
Japan Electronics Packaging and Circuits Association
Frequency:
Annual
Last Fair Information:
Electronics Component & Unit Show 2026 June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight General solution technologies using semiconductors and electronic components (semiconductors, electronic devices, sensors, mechanical components, FA control equipment, measuring instruments, power supplies, IoT and M2M solutions, manufacturing solutions and systems) Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Electronics Packaging and Circuits Association For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website:
Regions:
Industries:
Telecommunication /Telecommunication
Data Processing
Machinery
Industrial Technology /Electric & Electronics (Products
Machinery) Machinery
Industrial Technology /Manufacturing Technology & Engineering Machinery
Industrial Technology /Advanced Technology/Materials
Composites
R & D Information
Computer Information
Telecommunication /Optics
Optical Instruments
Laser
Online Trade Fair Details
| Title |
Electronics Component & Unit Show 2026 |
|||
|---|---|---|---|---|
3 Month Special Offer — Get 1 Month FreePay for 2 months, use 3 months. Unlimited premium access. |
||||
| Country | ||||
| City | Tokyo | |||
| Regions | APEC Countries Asia Eastern Asia | |||
| Industries | Telecommunication /Telecommunication Data Processing Machinery Industrial Technology /Electric & Electronics (Products Machinery) Machinery Industrial Technology /Manufacturing Technology & Engineering Machinery Industrial Technology /Advanced Technology/Materials Composites R & D Information Computer Information Telecommunication /Optics Optical Instruments Laser | |||
| Start Date | 09.06.2026 | |||
| End Date | 11.06.2026 | |||
| Venue | Tokyo Big Sight | |||
| Items to be Exhibited | General solution technologies using semiconductors and electronic components (semiconductors, electronic devices, sensors, mechanical components, FA control equipment, measuring instruments, power supplies, IoT and M2M solutions, manufacturing solutions and systems) | |||
| For Visitors | Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. | |||
| Organizer | Japan Electronics Packaging and Circuits Association | |||
| Message from Organizer | - | |||
| Frequency | Annual | |||
| Last Fair Information | Electronics Component & Unit Show 2026 June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight General solution technologies using semiconductors and electronic components (semiconductors, electronic devices, sensors, mechanical components, FA control equipment, measuring instruments, power supplies, IoT and M2M solutions, manufacturing solutions and systems) Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Electronics Packaging and Circuits Association For more detailed information of the trade fair, please check the official website of the individual organizer. | |||
| Official Website | Official Website | |||
| Share | ||||
| Title |
|---|
Electronics Component & Unit Show 2026 |
| Country |
| City |
| Tokyo |
| Regions |
| Industries |
|
Telecommunication /Telecommunication
Data Processing
Machinery
Industrial Technology /Electric & Electronics (Products
Machinery) Machinery
Industrial Technology /Manufacturing Technology & Engineering Machinery
Industrial Technology /Advanced Technology/Materials
Composites
R & D Information
Computer Information
Telecommunication /Optics
Optical Instruments
Laser
|
| Start Date |
| 09.06.2026 |
| End Date |
| 11.06.2026 |
| Venue |
| Tokyo Big Sight |
| Items to be Exhibited |
| General solution technologies using semiconductors and electronic components (semiconductors, electronic devices, sensors, mechanical components, FA control equipment, measuring instruments, power supplies, IoT and M2M solutions, manufacturing solutions and systems) |
| For Visitors |
| Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
| Japan Electronics Packaging and Circuits Association |
| Message from Organizer |
| Frequency |
| Annual |
| Last Fair Information |
| Electronics Component & Unit Show 2026 June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight General solution technologies using semiconductors and electronic components (semiconductors, electronic devices, sensors, mechanical components, FA control equipment, measuring instruments, power supplies, IoT and M2M solutions, manufacturing solutions and systems) Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Electronics Packaging and Circuits Association For more detailed information of the trade fair, please check the official website of the individual organizer. |
| Official Website |
| Visit Official Website |
| Share |
Tenders from United States of America
645-DOTRFB-2800-2026 Lubricating Oils Transportation
Organization:
***************
Country:
United States of America
Deadline:
15.07.2026
Major Procurement COMMODITIESThe Marshall County Board of Supervisors will receive sealed...MPTAP
Organization:
***************
Country:
United States of America
Deadline:
20.07.2026
Procurement of Veeam Software Renewal
Organization:
***************
Country:
United States of America
Deadline:
21.07.2026
Maj**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
23.07.2026
Maj**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
23.07.2026
Maj**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
24.07.2026
Edu**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
24.07.2026
Req**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
27.07.2026
DNR**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
28.07.2026
Maj**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
28.07.2026
The**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
28.07.2026
Lig**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
29.07.2026
Dis**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
29.07.2026
DMF**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
30.07.2026
005**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
30.07.2026
Cir**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
03.08.2026
AUD**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
05.08.2026
BEA**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
11.08.2026
RFP**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
11.08.2026
Env**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
27.08.2026
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