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Online Trade Fair Details
Title:
Semiconductor Industry Expo 2026
Country:
City:
Tokyo
Start Date:
09.06.2026
End Date:
11.06.2026
Venue:
Tokyo Big Sight
Items to be Exhibited:
Semiconductor design services/tools/design contracts, semiconductor manufacturing equipment/facilities/software, semiconductor manufacturing parts/materials, semiconductor inspection, testing, measurement and analysis equipment/services, semiconductor factory equipment/fixtures, staffing/logistics services for the semiconductor industry, other semiconductor-related products/services
For Visitors:
Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
Japan Electronics Packaging and Circuits Association Address : Innovent,Inc. Tel : +81-3-6812-9422
Frequency:
Annual
Last Fair Information:
Semiconductor Industry Expo 2026 June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight Semiconductor design services/tools/design contracts, semiconductor manufacturing equipment/facilities/software, semiconductor manufacturing parts/materials, semiconductor inspection, testing, measurement and analysis equipment/services, semiconductor factory equipment/fixtures, staffing/logistics services for the semiconductor industry, other semiconductor-related products/services Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Electronics Packaging and Circuits Association Address : Innovent,Inc. Tel : +81-3-6812-9422 For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website:
Regions:
Industries:
Telecommunication /Telecommunication
Data Processing
Machinery
Industrial Technology /Electric & Electronics (Products
Machinery) Machinery
Industrial Technology /Manufacturing Technology & Engineering Machinery
Industrial Technology /Advanced Technology/Materials
Composites
R & D Information
Computer Information
Telecommunication /Optics
Optical Instruments
Laser
Online Trade Fair Details
| Title |
Semiconductor Industry Expo 2026 |
|||
|---|---|---|---|---|
3 Month Special Offer — Get 1 Month FreePay for 2 months, use 3 months. Unlimited premium access. |
||||
| Country | ||||
| City | Tokyo | |||
| Regions | APEC Countries Asia Eastern Asia | |||
| Industries | Telecommunication /Telecommunication Data Processing Machinery Industrial Technology /Electric & Electronics (Products Machinery) Machinery Industrial Technology /Manufacturing Technology & Engineering Machinery Industrial Technology /Advanced Technology/Materials Composites R & D Information Computer Information Telecommunication /Optics Optical Instruments Laser | |||
| Start Date | 09.06.2026 | |||
| End Date | 11.06.2026 | |||
| Venue | Tokyo Big Sight | |||
| Items to be Exhibited | Semiconductor design services/tools/design contracts, semiconductor manufacturing equipment/facilities/software, semiconductor manufacturing parts/materials, semiconductor inspection, testing, measurement and analysis equipment/services, semiconductor factory equipment/fixtures, staffing/logistics services for the semiconductor industry, other semiconductor-related products/services | |||
| For Visitors | Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. | |||
| Organizer | Japan Electronics Packaging and Circuits Association Address : Innovent,Inc. Tel : +81-3-6812-9422 | |||
| Message from Organizer | - | |||
| Frequency | Annual | |||
| Last Fair Information | Semiconductor Industry Expo 2026 June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight Semiconductor design services/tools/design contracts, semiconductor manufacturing equipment/facilities/software, semiconductor manufacturing parts/materials, semiconductor inspection, testing, measurement and analysis equipment/services, semiconductor factory equipment/fixtures, staffing/logistics services for the semiconductor industry, other semiconductor-related products/services Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Electronics Packaging and Circuits Association Address : Innovent,Inc. Tel : +81-3-6812-9422 For more detailed information of the trade fair, please check the official website of the individual organizer. | |||
| Official Website | Official Website | |||
| Share | ||||
| Title |
|---|
Semiconductor Industry Expo 2026 |
| Country |
| City |
| Tokyo |
| Regions |
| Industries |
|
Telecommunication /Telecommunication
Data Processing
Machinery
Industrial Technology /Electric & Electronics (Products
Machinery) Machinery
Industrial Technology /Manufacturing Technology & Engineering Machinery
Industrial Technology /Advanced Technology/Materials
Composites
R & D Information
Computer Information
Telecommunication /Optics
Optical Instruments
Laser
|
| Start Date |
| 09.06.2026 |
| End Date |
| 11.06.2026 |
| Venue |
| Tokyo Big Sight |
| Items to be Exhibited |
| Semiconductor design services/tools/design contracts, semiconductor manufacturing equipment/facilities/software, semiconductor manufacturing parts/materials, semiconductor inspection, testing, measurement and analysis equipment/services, semiconductor factory equipment/fixtures, staffing/logistics services for the semiconductor industry, other semiconductor-related products/services |
| For Visitors |
| Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
| Japan Electronics Packaging and Circuits Association Address : Innovent,Inc. Tel : +81-3-6812-9422 |
| Message from Organizer |
| Frequency |
| Annual |
| Last Fair Information |
| Semiconductor Industry Expo 2026 June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight Semiconductor design services/tools/design contracts, semiconductor manufacturing equipment/facilities/software, semiconductor manufacturing parts/materials, semiconductor inspection, testing, measurement and analysis equipment/services, semiconductor factory equipment/fixtures, staffing/logistics services for the semiconductor industry, other semiconductor-related products/services Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Electronics Packaging and Circuits Association Address : Innovent,Inc. Tel : +81-3-6812-9422 For more detailed information of the trade fair, please check the official website of the individual organizer. |
| Official Website |
| Visit Official Website |
| Share |
Tenders from United States of America
Dell Laptops District of Columbia Office of Contracting and Procurement (DC OCP)
Organization:
***************
Country:
United States of America
Deadline:
16.07.2026
Governance as De-Risking Request for proposal
Organization:
***************
Country:
United States of America
Deadline:
17.07.2026
Credible Mentor services District of Columbia Office of Contracting and Procurement (DC OCP)
Organization:
***************
Country:
United States of America
Deadline:
20.07.2026
BAG**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
21.07.2026
KD/**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
21.07.2026
ST2**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
21.07.2026
MPD**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
28.07.2026
IFB**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
29.07.2026
SUB**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
30.07.2026
Pow**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
30.07.2026
Sch**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
03.08.2026
34B**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
05.08.2026
202**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
11.08.2026
MIL**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
11.08.2026
IFB**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
11.08.2026
N14**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
13.08.2026
LCP**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
14.08.2026
Veh**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
21.08.2026
Ren**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
25.08.2026
Veh**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
28.08.2026
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