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Title:
3rd POWER DEVICE & MODULE EXPO
Country:
Japan
City:
Tokyo
Start Date:
20.01.2026
End Date:
22.01.2026
Venue:
Tokyo Big Sight
Items to be Exhibited:
Technologies for Power Devices, Semiconductor Materials & Components, Manufacturing & Inspection Equipment, Analysis & Testing, Power Modulation Technologies, Power Devices, EMC & Noise Countermeasures, Thermal Management (Heat Dissipation & Cooling), Control, Drive, Sensing, Power Modules
For Visitors:
Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
RX Japan Ltd. Tel : +81-3-6739-4102 E-mail : [email protected]
Frequency:
Annual
Last Fair Information:
3rd POWER DEVICE & MODULE EXPO January 21, 2026 - January 23, 2026 Tokyo / Japan / Asia Tokyo Big Sight Technologies for Power Devices, Semiconductor Materials & Components, Manufacturing & Inspection Equipment, Analysis & Testing, Power Modulation Technologies, Power Devices, EMC & Noise Countermeasures, Thermal Management (Heat Dissipation & Cooling), Control, Drive, Sensing, Power Modules Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. RX Japan Ltd. Tel : +81-3-6739-4102 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website:
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Regions:
APEC Countries Asia Eastern Asia
Industries:
Machinery) Logistics Packaging ／Automobiles(incl. Parts Machinery Industrial Technology ／Electric & Electronics (Products Machinery) Machinery Industrial Technology ／Testing Measuring & Analyzing Precision Mechanics Machinery Industrial Technology ／Material Handling Pneumatics Machinery Industrial Technology ／Machine Tools Metalworking Machinery Industrial Technology ／Manufacturing Technology & Engineering Transportation
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