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Online Trade Fair Details
Title

JISSO PROTEC 2024

Country
Japan
City
Tokyo
Regions
APEC Countries Asia Eastern Asia
Industries
Machinery Industrial Technology ／Electric & Electronics (Products Industrial Technology ／Testing Measuring & Analyzing Precision Mechanics Machinery Waste Disposal Recycling Industrial Technology ／Manufacturing Technology & Engineering Machinery Machinery) Environment／Environmental Protection
Start Date
11.06.2024
End Date
13.06.2024
Venue
Tokyo Big Sight
Items to be Exhibited
Electronic component placement machine, electronic component insertion machine, cream solder printing machine, soldering device (reflow oven), dispenser, transport system, taping machine & material, bulk feeder & other feeder, automatic assembly device, wire bonder, die bonder, flip chip mounting system, LCD & COG bonding system, BGA & ILB system, COB system, board appearance inspection device, semiconductor manufacturing related inspection & measurement device, other mounting related inspection & measurement device, design tool, production optimization software, mounting programming device , SMD, semiconductor package parts, small electronic parts, chip parts, connectors & sockets, switches, bulk supply parts, taping reels, carrier tapes, TAB tapes & reels, magazine sticks, IC trays, bulk cases, soldering equipment, soldering & joining material, underfill material, high-frequency-enabled device & parts & material, environment-related equipment & material
For Visitors
Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer
Japan Robot Association (JARA) Tel : +81-03-3434-2919 E-mail : jisso@jara.jp Inquiry Form : https://www.jissoprotec.jp/contact/
Message from Organizer
Frequency
Annual
Last Fair Information
JISSO PROTEC 2024 June 12, 2024 - June 14, 2024 Tokyo / Japan / Asia Tokyo Big Sight Electronic component placement machine, electronic component insertion machine, cream solder printing machine, soldering device (reflow oven), dispenser, transport system, taping machine & material, bulk feeder & other feeder, automatic assembly device, wire bonder, die bonder, flip chip mounting system, LCD & COG bonding system, BGA & ILB system, COB system, board appearance inspection device, semiconductor manufacturing related inspection & measurement device, other mounting related inspection & measurement device, design tool, production optimization software, mounting programming device , SMD, semiconductor package parts, small electronic parts, chip parts, connectors & sockets, switches, bulk supply parts, taping reels, carrier tapes, TAB tapes & reels, magazine sticks, IC trays, bulk cases, soldering equipment, soldering & joining material, underfill material, high-frequency-enabled device & parts & material, environment-related equipment & material Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. Japan Robot Association (JARA) Tel : +81-03-3434-2919 E-mail : jisso@jara.jpInquiry Form : https://www.jissoprotec.jp/contact/ For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website
Official Website
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