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Title:
JISSO PROTEC 2024
Country:
Japan
City:
Tokyo
Start Date:
11.06.2024
End Date:
13.06.2024
Venue:
Tokyo Big Sight
Items to be Exhibited:
Electronic component placement machine, electronic component insertion machine, cream solder printing machine, soldering device (reflow oven), dispenser, transport system, taping machine & material, bulk feeder & other feeder, automatic assembly device, wire bonder, die bonder, flip chip mounting system, LCD & COG bonding system, BGA & ILB system, COB system, board appearance inspection device, semiconductor manufacturing related inspection & measurement device, other mounting related inspection & measurement device, design tool, production optimization software, mounting programming device , SMD, semiconductor package parts, small electronic parts, chip parts, connectors & sockets, switches, bulk supply parts, taping reels, carrier tapes, TAB tapes & reels, magazine sticks, IC trays, bulk cases, soldering equipment, soldering & joining material, underfill material, high-frequency-enabled device & parts & material, environment-related equipment & material
For Visitors:
Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
Japan Robot Association (JARA) Tel : +81-03-3434-2919 E-mail : [email protected] Inquiry Form : https://www.jissoprotec.jp/contact/
Frequency:
Annual
Last Fair Information:
JISSO PROTEC 2024 June 12, 2024 - June 14, 2024 Tokyo / Japan / Asia Tokyo Big Sight Electronic component placement machine, electronic component insertion machine, cream solder printing machine, soldering device (reflow oven), dispenser, transport system, taping machine & material, bulk feeder & other feeder, automatic assembly device, wire bonder, die bonder, flip chip mounting system, LCD & COG bonding system, BGA & ILB system, COB system, board appearance inspection device, semiconductor manufacturing related inspection & measurement device, other mounting related inspection & measurement device, design tool, production optimization software, mounting programming device , SMD, semiconductor package parts, small electronic parts, chip parts, connectors & sockets, switches, bulk supply parts, taping reels, carrier tapes, TAB tapes & reels, magazine sticks, IC trays, bulk cases, soldering equipment, soldering & joining material, underfill material, high-frequency-enabled device & parts & material, environment-related equipment & material Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. Japan Robot Association (JARA) Tel : +81-03-3434-2919 E-mail : [email protected] Form : https://www.jissoprotec.jp/contact/ For more detailed information of the trade fair, please check the official website of the individual organizer.
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Regions:
APEC Countries Asia Eastern Asia
Industries:
Machinery Industrial Technology ／Electric & Electronics (Products Industrial Technology ／Testing Measuring & Analyzing Precision Mechanics Machinery Waste Disposal Recycling Industrial Technology ／Manufacturing Technology & Engineering Machinery Machinery) Environment／Environmental Protection
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