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Online Trade Fair Details
| Title |
JISSO PROTEC 2024 |
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|---|---|---|---|---|
You can sign up and unlock it for freeAccess to Public and Private Sector Business Opportunities for 200+ Countries |
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| Country | ||||
| City | Tokyo | |||
| Regions | APEC Countries Asia Eastern Asia | |||
| Industries | Machinery Industrial Technology /Electric & Electronics (Products Industrial Technology /Testing Measuring & Analyzing Precision Mechanics Machinery Waste Disposal Recycling Industrial Technology /Manufacturing Technology & Engineering Machinery Machinery) Environment/Environmental Protection | |||
| Start Date | 11.06.2024 | |||
| End Date | 13.06.2024 | |||
| Venue | Tokyo Big Sight | |||
| Items to be Exhibited | Electronic component placement machine, electronic component insertion machine, cream solder printing machine, soldering device (reflow oven), dispenser, transport system, taping machine & material, bulk feeder & other feeder, automatic assembly device, wire bonder, die bonder, flip chip mounting system, LCD & COG bonding system, BGA & ILB system, COB system, board appearance inspection device, semiconductor manufacturing related inspection & measurement device, other mounting related inspection & measurement device, design tool, production optimization software, mounting programming device , SMD, semiconductor package parts, small electronic parts, chip parts, connectors & sockets, switches, bulk supply parts, taping reels, carrier tapes, TAB tapes & reels, magazine sticks, IC trays, bulk cases, soldering equipment, soldering & joining material, underfill material, high-frequency-enabled device & parts & material, environment-related equipment & material | |||
| For Visitors | Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. | |||
| Organizer | Japan Robot Association (JARA) Tel : +81-03-3434-2919 E-mail : [email protected] Inquiry Form : https://www.jissoprotec.jp/contact/ | |||
| Message from Organizer | - | |||
| Frequency | Annual | |||
| Last Fair Information | JISSO PROTEC 2024 June 12, 2024 - June 14, 2024 Tokyo / Japan / Asia Tokyo Big Sight Electronic component placement machine, electronic component insertion machine, cream solder printing machine, soldering device (reflow oven), dispenser, transport system, taping machine & material, bulk feeder & other feeder, automatic assembly device, wire bonder, die bonder, flip chip mounting system, LCD & COG bonding system, BGA & ILB system, COB system, board appearance inspection device, semiconductor manufacturing related inspection & measurement device, other mounting related inspection & measurement device, design tool, production optimization software, mounting programming device , SMD, semiconductor package parts, small electronic parts, chip parts, connectors & sockets, switches, bulk supply parts, taping reels, carrier tapes, TAB tapes & reels, magazine sticks, IC trays, bulk cases, soldering equipment, soldering & joining material, underfill material, high-frequency-enabled device & parts & material, environment-related equipment & material Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. Japan Robot Association (JARA) Tel : +81-03-3434-2919 E-mail : [email protected] Form : https://www.jissoprotec.jp/contact/ For more detailed information of the trade fair, please check the official website of the individual organizer. | |||
| Official Website | Official Website | |||
| Share | ||||
| Title |
|---|
JISSO PROTEC 2024 |
| Country |
|
Japan
|
| City |
| Tokyo |
| Regions |
| APEC Countries Asia Eastern Asia |
| Industries |
| Machinery Industrial Technology /Electric & Electronics (Products Industrial Technology /Testing Measuring & Analyzing Precision Mechanics Machinery Waste Disposal Recycling Industrial Technology /Manufacturing Technology & Engineering Machinery Machinery) Environment/Environmental Protection |
| Start Date |
| 11.06.2024 |
| End Date |
| 13.06.2024 |
| Venue |
| Tokyo Big Sight |
| Items to be Exhibited |
| Electronic component placement machine, electronic component insertion machine, cream solder printing machine, soldering device (reflow oven), dispenser, transport system, taping machine & material, bulk feeder & other feeder, automatic assembly device, wire bonder, die bonder, flip chip mounting system, LCD & COG bonding system, BGA & ILB system, COB system, board appearance inspection device, semiconductor manufacturing related inspection & measurement device, other mounting related inspection & measurement device, design tool, production optimization software, mounting programming device , SMD, semiconductor package parts, small electronic parts, chip parts, connectors & sockets, switches, bulk supply parts, taping reels, carrier tapes, TAB tapes & reels, magazine sticks, IC trays, bulk cases, soldering equipment, soldering & joining material, underfill material, high-frequency-enabled device & parts & material, environment-related equipment & material |
| For Visitors |
| Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
| Japan Robot Association (JARA) Tel : +81-03-3434-2919 E-mail : [email protected] Inquiry Form : https://www.jissoprotec.jp/contact/ |
| Message from Organizer |
| Frequency |
| Annual |
| Last Fair Information |
| JISSO PROTEC 2024 June 12, 2024 - June 14, 2024 Tokyo / Japan / Asia Tokyo Big Sight Electronic component placement machine, electronic component insertion machine, cream solder printing machine, soldering device (reflow oven), dispenser, transport system, taping machine & material, bulk feeder & other feeder, automatic assembly device, wire bonder, die bonder, flip chip mounting system, LCD & COG bonding system, BGA & ILB system, COB system, board appearance inspection device, semiconductor manufacturing related inspection & measurement device, other mounting related inspection & measurement device, design tool, production optimization software, mounting programming device , SMD, semiconductor package parts, small electronic parts, chip parts, connectors & sockets, switches, bulk supply parts, taping reels, carrier tapes, TAB tapes & reels, magazine sticks, IC trays, bulk cases, soldering equipment, soldering & joining material, underfill material, high-frequency-enabled device & parts & material, environment-related equipment & material Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. Japan Robot Association (JARA) Tel : +81-03-3434-2919 E-mail : [email protected] Form : https://www.jissoprotec.jp/contact/ For more detailed information of the trade fair, please check the official website of the individual organizer. |
| Official Website |
| Share |
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