Only curious? Unlock 1-Month Premium Free Trial Plan!
Online Trade Fair Details
Title:
2026 Microelectronics Show
Country:
City:
Tokyo
Start Date:
09.06.2026
End Date:
11.06.2026
Venue:
Tokyo Big Sight
Items to be Exhibited:
High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc.
For Visitors:
Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
JIEP
Frequency:
Annual
Last Fair Information:
2026 Microelectronics Show June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. JIEP For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website:
Regions:
Industries:
Machinery
Industrial Technology /Electric & Electronics (Products
Machinery) Machinery
Industrial Technology /Testing
Measuring & Analyzing
Precision Mechanics Machinery
Industrial Technology /Advanced Technology/Materials
Composites
R & D Machinery
Industrial Technology /Manufacturing Technology & Engineering
Online Trade Fair Details
| Title |
2026 Microelectronics Show |
|||
|---|---|---|---|---|
3 Month Special Offer — Get 1 Month FreePay for 2 months, use 3 months. Unlimited premium access. |
||||
| Country | ||||
| City | Tokyo | |||
| Regions | APEC Countries Asia Eastern Asia | |||
| Industries | Machinery Industrial Technology /Electric & Electronics (Products Machinery) Machinery Industrial Technology /Testing Measuring & Analyzing Precision Mechanics Machinery Industrial Technology /Advanced Technology/Materials Composites R & D Machinery Industrial Technology /Manufacturing Technology & Engineering | |||
| Start Date | 09.06.2026 | |||
| End Date | 11.06.2026 | |||
| Venue | Tokyo Big Sight | |||
| Items to be Exhibited | High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. | |||
| For Visitors | Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. | |||
| Organizer | JIEP | |||
| Message from Organizer | - | |||
| Frequency | Annual | |||
| Last Fair Information | 2026 Microelectronics Show June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. JIEP For more detailed information of the trade fair, please check the official website of the individual organizer. | |||
| Official Website | Official Website | |||
| Share | ||||
| Title |
|---|
2026 Microelectronics Show |
| Country |
| City |
| Tokyo |
| Regions |
| Industries |
|
Machinery
Industrial Technology /Electric & Electronics (Products
Machinery) Machinery
Industrial Technology /Testing
Measuring & Analyzing
Precision Mechanics Machinery
Industrial Technology /Advanced Technology/Materials
Composites
R & D Machinery
Industrial Technology /Manufacturing Technology & Engineering
|
| Start Date |
| 09.06.2026 |
| End Date |
| 11.06.2026 |
| Venue |
| Tokyo Big Sight |
| Items to be Exhibited |
| High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. |
| For Visitors |
| Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
| JIEP |
| Message from Organizer |
| Frequency |
| Annual |
| Last Fair Information |
| 2026 Microelectronics Show June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. JIEP For more detailed information of the trade fair, please check the official website of the individual organizer. |
| Official Website |
| Visit Official Website |
| Share |
Tenders from United States of America
Angio Mentor Flex Pro 3.3 Washington's Electronic Business Solution
Organization:
***************
Country:
United States of America
Deadline:
24.07.2026
Facility Wide Signage
Organization:
***************
Country:
United States of America
Deadline:
24.07.2026
WDFW Twin 150HP Outboard Engine Replacement and Installation Washington's Electronic Business Solution
Organization:
***************
Country:
United States of America
Deadline:
27.07.2026
Con**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
29.07.2026
SMA**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
29.07.2026
Sou**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
30.07.2026
Tow**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
30.07.2026
Rep**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
30.07.2026
Ele**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
04.08.2026
Fir**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
04.08.2026
Swe**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
12.08.2026
FDC**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
12.08.2026
Sta**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
13.08.2026
Men**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
14.08.2026
Fir**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
25.08.2026
Sin**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
26.08.2026
Com**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
28.08.2026
Deb**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
01.09.2026
Sys**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
14.10.2026
Sma**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
31.08.2027
Latest Articles
Netherlands Tenders 2026: COMPRANET Infrastructure & Energy Bids via Ten...
The Netherlands, a nation renowned for its innovation and robust economy, presents a dynamic public procurement market valued at approximately €73 billion an...
Gambia Tenders 2026: Health & Infrastructure Bids via TendersGo
The Gambia, a nation often called the "Smiling Coast of Africa," is bracing for a significant economic expansion in 2026. This isn't just about tourism; it's...
Bolivia Public Procurement Tenders 2026: SICOES Portal Guide & Foreign Bidding Intent
Bolivia's public procurement market presents significant opportunities for both local and international suppliers. In 2026, understanding the intricacies of...
Belgium Approves €1.566B RIZIV Healthcare Budget 2026 After INAMI Vote
The Belgian healthcare sector is poised for a significant year in 2026, following the National Institute for Health and Disability Insurance (INAMI/RIZIV) Ge...
How to Unlock Paraguay's Public Procurement Opportunities: A Guide to DNCP Tenders
Paraguay, often overlooked by some international bidders, presents a vibrant and increasingly transparent public procurement market. Imagine a market where g...
G20 Cross-Border Infrastructure Pipeline Unlocks $200B Private Investment in 2026
The G20 nations are intensifying efforts to bridge significant infrastructure deficits across developing economies, particularly within Africa, by refining s...



