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Online Trade Fair Details
Title:
2026 Microelectronics Show
Country:
Japan
City:
Tokyo
Start Date:
09.06.2026
End Date:
11.06.2026
Venue:
Tokyo Big Sight
Items to be Exhibited:
High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc.
For Visitors:
Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
JIEP
Frequency:
Annual
Last Fair Information:
2026 Microelectronics Show June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. JIEP For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website:
Regions:
Industries:
Machinery
Industrial Technology ／Electric & Electronics (Products
Machinery) Machinery
Industrial Technology ／Testing
Measuring & Analyzing
Precision Mechanics Machinery
Industrial Technology ／Advanced Technology/Materials
Composites
R & D Machinery
Industrial Technology ／Manufacturing Technology & Engineering
Online Trade Fair Details
| Title |
2026 Microelectronics Show |
|||
|---|---|---|---|---|
Start Your 1-Month Free Trial TodayTry unlimited premium features for free for one month |
||||
| Country | ||||
| City | Tokyo | |||
| Regions | APEC Countries Asia Eastern Asia | |||
| Industries | Machinery Industrial Technology ／Electric & Electronics (Products Machinery) Machinery Industrial Technology ／Testing Measuring & Analyzing Precision Mechanics Machinery Industrial Technology ／Advanced Technology/Materials Composites R & D Machinery Industrial Technology ／Manufacturing Technology & Engineering | |||
| Start Date | 09.06.2026 | |||
| End Date | 11.06.2026 | |||
| Venue | Tokyo Big Sight | |||
| Items to be Exhibited | High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. | |||
| For Visitors | Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. | |||
| Organizer | JIEP | |||
| Message from Organizer | - | |||
| Frequency | Annual | |||
| Last Fair Information | 2026 Microelectronics Show June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. JIEP For more detailed information of the trade fair, please check the official website of the individual organizer. | |||
| Official Website | Official Website | |||
| Share | ||||
| Title |
|---|
2026 Microelectronics Show |
| Country |
| City |
| Tokyo |
| Regions |
| Industries |
|
Machinery
Industrial Technology ／Electric & Electronics (Products
Machinery) Machinery
Industrial Technology ／Testing
Measuring & Analyzing
Precision Mechanics Machinery
Industrial Technology ／Advanced Technology/Materials
Composites
R & D Machinery
Industrial Technology ／Manufacturing Technology & Engineering
|
| Start Date |
| 09.06.2026 |
| End Date |
| 11.06.2026 |
| Venue |
| Tokyo Big Sight |
| Items to be Exhibited |
| High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. |
| For Visitors |
| Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
| JIEP |
| Message from Organizer |
| Frequency |
| Annual |
| Last Fair Information |
| 2026 Microelectronics Show June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. JIEP For more detailed information of the trade fair, please check the official website of the individual organizer. |
| Official Website |
| Visit Official Website |
| Share |
Tenders from United States of America
INF-2026-0210 | Poly Bag 37" X 50" Black 25% Recycled SIZE 44-48 Gallon: Dry weight 100Lbs. packed in boxes, 100 per case City of Houston - Houston Airport System
Organization:
*************** 
Country:
United States of America
United States of America
Deadline:
01.06.2026
CPH - Waist Pack - Brian Sturgill | Health City of Columbus
Organization:
***************
Country:
United States of America
United States of America
Deadline:
03.06.2026
IFQ 8700 HAW1003 Racial Bias Awareness Training
Organization:
***************
Country:
United States of America
United States of America
Deadline:
03.06.2026
CPH**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
04.06.2026
INF**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
04.06.2026
600**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
05.06.2026
Gol**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
05.06.2026
AED**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
05.06.2026
INF**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
05.06.2026
INF**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
05.06.2026
600**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
09.06.2026
RFP**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
11.06.2026
RFQ**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
18.06.2026
Ubi**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
19.06.2026
RFQ**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
24.06.2026
CB-**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
02.07.2026
CB-**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
02.07.2026
CB-**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
02.07.2026
CB-**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
09.07.2026
CB-**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
United States of America
Deadline:
09.07.2026
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