Online Trade Fair Details
Title

SEMISOL 2025

Country
Japan
City
Tokyo
Regions
APEC Countries Asia Eastern Asia
Industries
Telecommunication /Telecommunication Data Processing Startups/Innovation Startups Machinery Industrial Technology /Electric & Electronics (Products Machinery) Information Industrial Technology /Testing Measuring & Analyzing Precision Mechanics Machinery Computer Innovation
Start Date
17.06.2025
End Date
19.06.2025
Venue
Tokyo Big Sight Expected floor size :1,080 sq.m.
Items to be Exhibited
Materials, components, and manufacturing equipment technology for semiconductor post-processing, semiconductor manufacturing technology, chiplets (2.5D/3D packaging), advanced chiplet technology, semiconductor post-processing technologies, TSV (through-silicon via) and RDL (redistribution layer), packaging technology, materials, and components, heterogeneous bonding, sealing materials, resists, other materials and components, package substrates (printed circuit boards, tape substrates, ceramic substrates), package analysis and simulation software, grinding, dicing, die bonding, wire bonding, molding technologies, materials, equipment, and products, analytical equipment, inspection equipment, universities and research institutes
For Visitors
Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer
JTB Communication Design Inc. Tel : +81-3-5657-0771 E-mail : [email protected] Inquiry Form : https://jcd-event.smktg.jp/public/application/add/2911
Message from Organizer
Frequency
Annual
Last Fair Information
SEMISOL 2025 June 18, 2025 - June 20, 2025 Tokyo / Japan / Asia Tokyo Big Sight Expected floor size :1,080 sq.m. Materials, components, and manufacturing equipment technology for semiconductor post-processing, semiconductor manufacturing technology, chiplets (2.5D/3D packaging), advanced chiplet technology, semiconductor post-processing technologies, TSV (through-silicon via) and RDL (redistribution layer), packaging technology, materials, and components, heterogeneous bonding, sealing materials, resists, other materials and components, package substrates (printed circuit boards, tape substrates, ceramic substrates), package analysis and simulation software, grinding, dicing, die bonding, wire bonding, molding technologies, materials, equipment, and products, analytical equipment, inspection equipment, universities and research institutes Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. JTB Communication Design Inc. Tel : +81-3-5657-0771 E-mail : [email protected] Form : https://jcd-event.smktg.jp/public/application/add/2911 For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website
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