Online Trade Fair Details
Title

JPCA Show 2024 (International Electronic Circuits Exhibition) - Module Japan

Country
Japan
City
Tokyo
Regions
APEC Countries Asia Eastern Asia
Industries
Logistics Machinery Industrial Technology /Electric & Electronics (Products Machinery) Machinery Industrial Technology /Testing Measuring & Analyzing Precision Mechanics Machinery Industrial Technology /Advanced Technology/Materials Composites Industrial Technology /Metals Metal Products Hardware Tools Machinery R & D Machinery Packaging /Logistics Storage Industrial Technology /Machine Tools Warehousing Metalworking Transportation
Start Date
11.06.2024
End Date
13.06.2024
Venue
Tokyo Big Sight
Items to be Exhibited
Various straight, package, interposer, built-in electronic circuit board, WLCSP / WLP, BGA (CSP), LGA, QFN, chip parts, bare die, various modules, function & logic design technology, other various design & support tools, electromagnetic field analysis (EMC / EMI / SI measures), CAE support equipment such as CAD & CAM & CIM, inspection & evaluation & analysis system, various alloys, wiring & board material, polyimide film / tape, ceramic substrate material, silicon wafer, glass blanks, plating & mold Manufacturing technology, materials and equipment, chemical processing, photographic exposure equipment, machining, transport, coating, washing, etc., various manufacturing equipment, environmental and energy saving systems, logistics systems, inventory management systems, security, traceability management, etc.
For Visitors
Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer
JPCA Tel : +81-3-5310-2020 E-mail : [email protected]
Message from Organizer
Frequency
Annual
Last Fair Information
JPCA Show 2024 (International Electronic Circuits Exhibition) - Module Japan June 12, 2024 - June 14, 2024 Tokyo / Japan / Asia Tokyo Big Sight Various straight, package, interposer, built-in electronic circuit board, WLCSP / WLP, BGA (CSP), LGA, QFN, chip parts, bare die, various modules, function & logic design technology, other various design & support tools, electromagnetic field analysis (EMC / EMI / SI measures), CAE support equipment such as CAD & CAM & CIM, inspection & evaluation & analysis system, various alloys, wiring & board material, polyimide film / tape, ceramic substrate material, silicon wafer, glass blanks, plating & mold Manufacturing technology, materials and equipment, chemical processing, photographic exposure equipment, machining, transport, coating, washing, etc., various manufacturing equipment, environmental and energy saving systems, logistics systems, inventory management systems, security, traceability management, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. JPCA Tel : +81-3-5310-2020 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website
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