Sign up now to have the right to view
50 tenders for free.
Online Trade Fair Details
| Title |
9th Adhesion & Bonding Expo Osaka |
|||
|---|---|---|---|---|
You can sign up and unlock it for freeAccess to Public and Private Sector Business Opportunities for 200+ Countries |
||||
| Country | ||||
| City | Osaka (Osaka) | |||
| Regions | APEC Countries Asia Eastern Asia | |||
| Industries | Rubber Plastics Logistics Packaging ／Automobiles(incl. Parts Machinery) Transportation Packaging ／Marine Shipbuilding Shipping Port Equipment Transportation Fundamental Industries／Chemistry Materials Machinery Industrial Technology ／Manufacturing Technology & Engineering Machinery Industrial Technology ／Advanced Technology/Materials Composites Packaging ／Aerospace & Aviation Airport Equipment R & D Transportation | |||
| Start Date | 13.05.2025 | |||
| End Date | 15.05.2025 | |||
| Venue | INTEX Osaka | |||
| Items to be Exhibited | Adhesive Materials, Adhesive Films & Tapes, Joining Equipment & Technologies, Surface Treatment Equipment, Testing/Measurement/Analysis, Design Simulation Tools | |||
| For Visitors | Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. | |||
| Organizer | RX Japan Ltd. Tel : +81-3-6739-4118 E-mail : mw-j.jp@rxglobal.com | |||
| Message from Organizer | - | |||
| Frequency | Annual | |||
| Last Fair Information | 9th Adhesion & Bonding Expo Osaka May 14, 2025 - May 16, 2025 Osaka (Osaka) / Japan / Asia INTEX Osaka Adhesive Materials, Adhesive Films & Tapes, Joining Equipment & Technologies, Surface Treatment Equipment, Testing/Measurement/Analysis, Design Simulation Tools Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. RX Japan Ltd. Tel : +81-3-6739-4118 E-mail : mw-j.jp@rxglobal.com For more detailed information of the trade fair, please check the official website of the individual organizer. | |||
| Official Website | Official Website | |||
| Share | ||||
Japan
| Title |
|---|
9th Adhesion & Bonding Expo Osaka |
| Country |
|
Japan
|
| City |
| Osaka (Osaka) |
| Regions |
| APEC Countries Asia Eastern Asia |
| Industries |
| Rubber Plastics Logistics Packaging ／Automobiles(incl. Parts Machinery) Transportation Packaging ／Marine Shipbuilding Shipping Port Equipment Transportation Fundamental Industries／Chemistry Materials Machinery Industrial Technology ／Manufacturing Technology & Engineering Machinery Industrial Technology ／Advanced Technology/Materials Composites Packaging ／Aerospace & Aviation Airport Equipment R & D Transportation |
| Start Date |
| 13.05.2025 |
| End Date |
| 15.05.2025 |
| Venue |
| INTEX Osaka |
| Items to be Exhibited |
| Adhesive Materials, Adhesive Films & Tapes, Joining Equipment & Technologies, Surface Treatment Equipment, Testing/Measurement/Analysis, Design Simulation Tools |
| For Visitors |
| Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
| RX Japan Ltd. Tel : +81-3-6739-4118 E-mail : mw-j.jp@rxglobal.com |
| Message from Organizer |
| Frequency |
| Annual |
| Last Fair Information |
| 9th Adhesion & Bonding Expo Osaka May 14, 2025 - May 16, 2025 Osaka (Osaka) / Japan / Asia INTEX Osaka Adhesive Materials, Adhesive Films & Tapes, Joining Equipment & Technologies, Surface Treatment Equipment, Testing/Measurement/Analysis, Design Simulation Tools Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. RX Japan Ltd. Tel : +81-3-6739-4118 E-mail : mw-j.jp@rxglobal.com For more detailed information of the trade fair, please check the official website of the individual organizer. |
| Official Website |
| Share |
To be notified
when a tender matching your filter is
published
To Follow
Tenders
Add New Tender Alert
To Follow
Contracts
Add New Contract Alert
To Follow
Fairs
Add New Fair Alert
