Online Trade Fair Details
Title:
9th Adhesion & Bonding Expo Osaka
Country:
City:
Osaka (Osaka)
Start Date:
13.05.2025
End Date:
15.05.2025
Venue:
INTEX Osaka
Items to be Exhibited:
Adhesive Materials, Adhesive Films & Tapes, Joining Equipment & Technologies, Surface Treatment Equipment, Testing/Measurement/Analysis, Design Simulation Tools
For Visitors:
Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
RX Japan Ltd. Tel : +81-3-6739-4118 E-mail : [email protected]
Frequency:
Annual
Last Fair Information:
9th Adhesion & Bonding Expo Osaka May 14, 2025 - May 16, 2025 Osaka (Osaka) / Japan / Asia INTEX Osaka Adhesive Materials, Adhesive Films & Tapes, Joining Equipment & Technologies, Surface Treatment Equipment, Testing/Measurement/Analysis, Design Simulation Tools Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. RX Japan Ltd. Tel : +81-3-6739-4118 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website:
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