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Title:
OSAT Solution Show 2026
Country:
Japan
City:
Tokyo
Start Date:
09.06.2026
End Date:
11.06.2026
Venue:
Tokyo Big Sight
Items to be Exhibited:
General technologies, materials, and equipment related to semiconductor post-processing (packaging materials, assembly equipment, wafer-level packaging, fan-out packaging (FO-WLP, FO-PLP), 3D/2.5D packaging, PLP, test systems, handling equipment, package design tools, simulators, etc.)
For Visitors:
Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
Japan Electronics Packaging and Circuits Association
Frequency:
Annual
Last Fair Information:
OSAT Solution Show 2026 June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight General technologies, materials, and equipment related to semiconductor post-processing (packaging materials, assembly equipment, wafer-level packaging, fan-out packaging (FO-WLP, FO-PLP), 3D/2.5D packaging, PLP, test systems, handling equipment, package design tools, simulators, etc.) Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Electronics Packaging and Circuits Association For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website:
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Regions:
APEC Countries Asia Eastern Asia
Industries:
Telecommunication ／Telecommunication Data Processing Machinery Industrial Technology ／Electric & Electronics (Products Machinery) Machinery Industrial Technology ／Manufacturing Technology & Engineering Machinery Industrial Technology ／Advanced Technology/Materials Composites R & D Information Computer Information Telecommunication ／Optics Optical Instruments Laser
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