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Online Trade Fair Details
Title:
Total Solution Exhibition for Electronic Equipment 2026
Country:
City:
Tokyo
Start Date:
09.06.2026
End Date:
11.06.2026
Venue:
Tokyo Big Sight
Items to be Exhibited:
Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc.
For Visitors:
Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
Japan Electronics Packaging and Circuits Association
Frequency:
Annual
Last Fair Information:
Total Solution Exhibition for Electronic Equipment 2026 June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Electronics Packaging and Circuits Association For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website:
Regions:
Industries:
Telecommunication /Telecommunication
Data Processing
Machinery
Industrial Technology /Electric & Electronics (Products
Machinery) Machinery
Industrial Technology /Manufacturing Technology & Engineering Machinery
Industrial Technology /Advanced Technology/Materials
Composites
R & D Information
Computer Information
Telecommunication /Optics
Optical Instruments
Laser
Online Trade Fair Details
| Title |
Total Solution Exhibition for Electronic Equipment 2026 |
|||
|---|---|---|---|---|
3 Month Special Offer — Get 1 Month FreePay for 2 months, use 3 months. Unlimited premium access. |
||||
| Country | ||||
| City | Tokyo | |||
| Regions | APEC Countries Asia Eastern Asia | |||
| Industries | Telecommunication /Telecommunication Data Processing Machinery Industrial Technology /Electric & Electronics (Products Machinery) Machinery Industrial Technology /Manufacturing Technology & Engineering Machinery Industrial Technology /Advanced Technology/Materials Composites R & D Information Computer Information Telecommunication /Optics Optical Instruments Laser | |||
| Start Date | 09.06.2026 | |||
| End Date | 11.06.2026 | |||
| Venue | Tokyo Big Sight | |||
| Items to be Exhibited | Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc. | |||
| For Visitors | Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. | |||
| Organizer | Japan Electronics Packaging and Circuits Association | |||
| Message from Organizer | - | |||
| Frequency | Annual | |||
| Last Fair Information | Total Solution Exhibition for Electronic Equipment 2026 June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Electronics Packaging and Circuits Association For more detailed information of the trade fair, please check the official website of the individual organizer. | |||
| Official Website | Official Website | |||
| Share | ||||
| Title |
|---|
Total Solution Exhibition for Electronic Equipment 2026 |
| Country |
| City |
| Tokyo |
| Regions |
| Industries |
|
Telecommunication /Telecommunication
Data Processing
Machinery
Industrial Technology /Electric & Electronics (Products
Machinery) Machinery
Industrial Technology /Manufacturing Technology & Engineering Machinery
Industrial Technology /Advanced Technology/Materials
Composites
R & D Information
Computer Information
Telecommunication /Optics
Optical Instruments
Laser
|
| Start Date |
| 09.06.2026 |
| End Date |
| 11.06.2026 |
| Venue |
| Tokyo Big Sight |
| Items to be Exhibited |
| Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc. |
| For Visitors |
| Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
| Japan Electronics Packaging and Circuits Association |
| Message from Organizer |
| Frequency |
| Annual |
| Last Fair Information |
| Total Solution Exhibition for Electronic Equipment 2026 June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Electronics Packaging and Circuits Association For more detailed information of the trade fair, please check the official website of the individual organizer. |
| Official Website |
| Visit Official Website |
| Share |
Tenders from United States of America
ASBCE Clanton Lawn & Landscape 2027 Alabama State Board of Chiropractic Examiners | CHIROPRACTIC EXAMINERS BOARD | ASBCE Clanton Lawn & Landscape 2027 SRC0000033848
Organization:
***************
Country:
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Deadline:
16.07.2026
190418-Traffic Homicide Headquarters | 190418-Traffic Homicide SRC0000034549
Organization:
***************
Country:
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Deadline:
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Sole Source G34-604231 - Criminal Investigation Online System G34 Office of Homeland Security | Sole Source G34-604231 - Criminal Investigation Online System SRC0000034461
Organization:
***************
Country:
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Deadline:
17.07.2026
Cru**************************************************************************************************************************************
Organization:
***************
Country:
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Deadline:
17.07.2026
SRT**************************************************************************************************************************************
Organization:
***************
Country:
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Deadline:
17.07.2026
SRT**************************************************************************************************************************************
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Country:
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Deadline:
17.07.2026
250**************************************************************************************************************************************
Organization:
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Country:
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Deadline:
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GKI**************************************************************************************************************************************
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Deadline:
17.07.2026
Jan**************************************************************************************************************************************
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Country:
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Deadline:
23.07.2026
Jan**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
23.07.2026
Jan**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
23.07.2026
Jan**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
23.07.2026
26P**************************************************************************************************************************************
Organization:
***************
Country:
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Deadline:
25.07.2026
Cha**************************************************************************************************************************************
Organization:
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Country:
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Deadline:
28.07.2026
EME**************************************************************************************************************************************
Organization:
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Country:
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Deadline:
30.07.2026
120**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
04.08.2026
She**************************************************************************************************************************************
Organization:
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Country:
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Deadline:
15.08.2026
She**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
15.08.2026
ALP**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
17.08.2026
102**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
18.08.2026



