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Online Trade Fair Details
Title |
Total Solution Exhibition for Electronic Equipment 2025 |
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Country | ||||
City | Tokyo | |||
Regions | APEC Countries Asia Eastern Asia | |||
Industries | Telecommunication /Telecommunication Data Processing Machinery Industrial Technology /Electric & Electronics (Products Machinery) Machinery Industrial Technology /Manufacturing Technology & Engineering Machinery Industrial Technology /Advanced Technology/Materials Composites R & D Information Computer Information Telecommunication /Optics Optical Instruments Laser | |||
Start Date | 03.06.2025 | |||
End Date | 05.06.2025 | |||
Venue | Tokyo Big Sight | |||
Items to be Exhibited | Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc. | |||
For Visitors | Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. | |||
Organizer | Japan Electronics Packaging and Circuits Association | |||
Message from Organizer | - | |||
Frequency | Annual | |||
Last Fair Information | Total Solution Exhibition for Electronic Equipment 2025 June 4, 2025 - June 6, 2025 Tokyo / Japan / Asia Tokyo Big Sight Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Electronics Packaging and Circuits Association For more detailed information of the trade fair, please check the official website of the individual organizer. | |||
Official Website | Official Website | |||
Share |
Title |
---|
Total Solution Exhibition for Electronic Equipment 2025 |
Country |
Japan
|
City |
Tokyo |
Regions |
APEC Countries Asia Eastern Asia |
Industries |
Telecommunication /Telecommunication Data Processing Machinery Industrial Technology /Electric & Electronics (Products Machinery) Machinery Industrial Technology /Manufacturing Technology & Engineering Machinery Industrial Technology /Advanced Technology/Materials Composites R & D Information Computer Information Telecommunication /Optics Optical Instruments Laser |
Start Date |
03.06.2025 |
End Date |
05.06.2025 |
Venue |
Tokyo Big Sight |
Items to be Exhibited |
Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc. |
For Visitors |
Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. |
Organizer |
Japan Electronics Packaging and Circuits Association |
Message from Organizer |
Frequency |
Annual |
Last Fair Information |
Total Solution Exhibition for Electronic Equipment 2025 June 4, 2025 - June 6, 2025 Tokyo / Japan / Asia Tokyo Big Sight Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Electronics Packaging and Circuits Association For more detailed information of the trade fair, please check the official website of the individual organizer. |
Official Website |
Share |
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