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Online Trade Fair Details
Title

2024 Microelectronics Show

Country
Japan
City
Tokyo
Regions
APEC Countries Asia Eastern Asia
Industries
Machinery Industrial Technology ／Electric & Electronics (Products Machinery) Machinery Industrial Technology ／Testing Measuring & Analyzing Precision Mechanics Machinery Industrial Technology ／Advanced Technology/Materials Composites R & D Machinery Industrial Technology ／Manufacturing Technology & Engineering
Start Date
11.06.2024
End Date
13.06.2024
Venue
Tokyo Big Sight
Items to be Exhibited
High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc.
For Visitors
Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer
JIEP Tel : +81-3-5310-2020 E-mail : show@jpca.org
Message from Organizer
Frequency
Annual
Last Fair Information
2024 Microelectronics Show June 12, 2024 - June 14, 2024 Tokyo / Japan / Asia Tokyo Big Sight High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc. Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. JIEP Tel : +81-3-5310-2020 E-mail : show@jpca.org For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website
Official Website
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