Register Login
Online Trade Fair Details
30 Day Free Trial
Title:
JISSO PROTEC 2025
Country:
Japan
City:
Tokyo
Start Date:
03.06.2025
End Date:
04.06.2025
Venue:
Tokyo Big Sight
Items to be Exhibited:
Electronic component placement machine, electronic component insertion machine, cream solder printing machine, soldering device (reflow oven), dispenser, transport system, taping machine & material, bulk feeder & other feeder, automatic assembly device, wire bonder, die bonder, flip chip mounting system, LCD & COG bonding system, BGA & ILB system, COB system, board appearance inspection device, semiconductor manufacturing related inspection & measurement device, other mounting related inspection & measurement device, design tool, production optimization software, mounting programming device , SMD, semiconductor package parts, small electronic parts, chip parts, connectors & sockets, switches, bulk supply parts, taping reels, carrier tapes, TAB tapes & reels, magazine sticks, IC trays, bulk cases, soldering equipment, soldering & joining material, underfill material, high-frequency-enabled device & parts & material, environment-related equipment & material
For Visitors:
Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
Japan Robot Association (JARA)
Frequency:
Annual
Last Fair Information:
JISSO PROTEC 2025 June 4, 2025 - June 5, 2025 Tokyo / Japan / Asia Tokyo Big Sight Electronic component placement machine, electronic component insertion machine, cream solder printing machine, soldering device (reflow oven), dispenser, transport system, taping machine & material, bulk feeder & other feeder, automatic assembly device, wire bonder, die bonder, flip chip mounting system, LCD & COG bonding system, BGA & ILB system, COB system, board appearance inspection device, semiconductor manufacturing related inspection & measurement device, other mounting related inspection & measurement device, design tool, production optimization software, mounting programming device , SMD, semiconductor package parts, small electronic parts, chip parts, connectors & sockets, switches, bulk supply parts, taping reels, carrier tapes, TAB tapes & reels, magazine sticks, IC trays, bulk cases, soldering equipment, soldering & joining material, underfill material, high-frequency-enabled device & parts & material, environment-related equipment & material Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. Japan Robot Association (JARA) For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website:
Visit Official Website
Share:
Regions:
APEC Countries Asia Eastern Asia
Industries:
Machinery Industrial Technology ／Electric & Electronics (Products Industrial Technology ／Testing Measuring & Analyzing Precision Mechanics Machinery Waste Disposal Recycling Industrial Technology ／Manufacturing Technology & Engineering Machinery Machinery) Environment／Environmental Protection
Export requests Import requests Partnership requests Service requests