Online Trade Fair Details
Title

10th Adhesion & Bonding Expo Osaka

Country
Japan
City
Osaka (Osaka)
Regions
APEC Countries Asia Eastern Asia
Industries
Rubber Plastics Logistics Packaging /Automobiles(incl. Parts Machinery) Transportation Packaging /Marine Shipbuilding Shipping Port Equipment Transportation Fundamental Industries/Chemistry Materials Machinery Industrial Technology /Manufacturing Technology & Engineering Machinery Industrial Technology /Advanced Technology/Materials Composites Packaging /Aerospace & Aviation Airport Equipment R & D Transportation
Start Date
12.05.2026
End Date
14.05.2026
Venue
INTEX Osaka
Items to be Exhibited
Adhesive Materials, Adhesive Films & Tapes, Joining Equipment & Technologies, Surface Treatment Equipment, Testing/Measurement/Analysis, Design Simulation Tools
For Visitors
Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer
RX Japan Ltd. Tel : +81-3-6739-4118 E-mail : [email protected]
Message from Organizer
Frequency
Annual
Last Fair Information
10th Adhesion & Bonding Expo Osaka May 13, 2026 - May 15, 2026 Osaka (Osaka) / Japan / Asia INTEX Osaka Adhesive Materials, Adhesive Films & Tapes, Joining Equipment & Technologies, Surface Treatment Equipment, Testing/Measurement/Analysis, Design Simulation Tools Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. RX Japan Ltd. Tel : +81-3-6739-4118 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website
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