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Online Trade Fair Details
Title:
EdgeTech+ 2025
Country:
City:
Yokohama (Kanagawa)
Start Date:
18.11.2025
End Date:
20.11.2025
Venue:
Pacifico Yokohama Expected floor size :20,000 sq.m.
Items to be Exhibited:
AI, IoT, embedded software, embedded hardware, semiconductor devices, development support, development environment, safety and security, wireless, cloud native, agile, DevOps, reskilling, software human resource development, image recognition AI, open source software
For Visitors:
Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
Japan Embedded Systems Technology Association Tel : +81-3-6258-0589 E-mail : [email protected]
Frequency:
Annual
Last Fair Information:
EdgeTech+ 2025 November 19, 2025 - November 21, 2025 Yokohama (Kanagawa) / Japan / Asia Pacifico Yokohama Expected floor size :20,000 sq.m. AI, IoT, embedded software, embedded hardware, semiconductor devices, development support, development environment, safety and security, wireless, cloud native, agile, DevOps, reskilling, software human resource development, image recognition AI, open source software Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Embedded Systems Technology Association Tel : +81-3-6258-0589 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website:
Regions:
Industries:
Telecommunication /Telecommunication
Data Processing
Logistics
Packaging /Automobiles(incl. Parts
Machinery) Transportation
Machinery
Industrial Technology /Electric & Electronics (Products
Machinery) Machinery
Industrial Technology /Testing
Measuring & Analyzing
Precision Mechanics Machinery
Computer Transportation
Industrial Technology /Manufacturing Technology & Engineering Information
Packaging /Rail Traffic & Other Transportation Machinery
Online Trade Fair Details
| Title |
EdgeTech+ 2025 |
|||
|---|---|---|---|---|
Start Your 1-Month Free Trial TodayTry unlimited premium features for free for one month |
||||
| Country | ||||
| City | Yokohama (Kanagawa) | |||
| Regions | APEC Countries Asia Eastern Asia | |||
| Industries | Telecommunication /Telecommunication Data Processing Logistics Packaging /Automobiles(incl. Parts Machinery) Transportation Machinery Industrial Technology /Electric & Electronics (Products Machinery) Machinery Industrial Technology /Testing Measuring & Analyzing Precision Mechanics Machinery Computer Transportation Industrial Technology /Manufacturing Technology & Engineering Information Packaging /Rail Traffic & Other Transportation Machinery | |||
| Start Date | 18.11.2025 | |||
| End Date | 20.11.2025 | |||
| Venue | Pacifico Yokohama Expected floor size :20,000 sq.m. | |||
| Items to be Exhibited | AI, IoT, embedded software, embedded hardware, semiconductor devices, development support, development environment, safety and security, wireless, cloud native, agile, DevOps, reskilling, software human resource development, image recognition AI, open source software | |||
| For Visitors | Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. | |||
| Organizer | Japan Embedded Systems Technology Association Tel : +81-3-6258-0589 E-mail : [email protected] | |||
| Message from Organizer | - | |||
| Frequency | Annual | |||
| Last Fair Information | EdgeTech+ 2025 November 19, 2025 - November 21, 2025 Yokohama (Kanagawa) / Japan / Asia Pacifico Yokohama Expected floor size :20,000 sq.m. AI, IoT, embedded software, embedded hardware, semiconductor devices, development support, development environment, safety and security, wireless, cloud native, agile, DevOps, reskilling, software human resource development, image recognition AI, open source software Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Embedded Systems Technology Association Tel : +81-3-6258-0589 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer. | |||
| Official Website | Official Website | |||
| Share | ||||
| Title |
|---|
EdgeTech+ 2025 |
| Country |
| City |
| Yokohama (Kanagawa) |
| Regions |
| Industries |
|
Telecommunication /Telecommunication
Data Processing
Logistics
Packaging /Automobiles(incl. Parts
Machinery) Transportation
Machinery
Industrial Technology /Electric & Electronics (Products
Machinery) Machinery
Industrial Technology /Testing
Measuring & Analyzing
Precision Mechanics Machinery
Computer Transportation
Industrial Technology /Manufacturing Technology & Engineering Information
Packaging /Rail Traffic & Other Transportation Machinery
|
| Start Date |
| 18.11.2025 |
| End Date |
| 20.11.2025 |
| Venue |
| Pacifico Yokohama Expected floor size :20,000 sq.m. |
| Items to be Exhibited |
| AI, IoT, embedded software, embedded hardware, semiconductor devices, development support, development environment, safety and security, wireless, cloud native, agile, DevOps, reskilling, software human resource development, image recognition AI, open source software |
| For Visitors |
| Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
| Japan Embedded Systems Technology Association Tel : +81-3-6258-0589 E-mail : [email protected] |
| Message from Organizer |
| Frequency |
| Annual |
| Last Fair Information |
| EdgeTech+ 2025 November 19, 2025 - November 21, 2025 Yokohama (Kanagawa) / Japan / Asia Pacifico Yokohama Expected floor size :20,000 sq.m. AI, IoT, embedded software, embedded hardware, semiconductor devices, development support, development environment, safety and security, wireless, cloud native, agile, DevOps, reskilling, software human resource development, image recognition AI, open source software Eligibility : Trade & general public Method of admission : Apply/register online For details, please contact the organizer directly. Japan Embedded Systems Technology Association Tel : +81-3-6258-0589 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer. |
| Official Website |
| Visit Official Website |
| Share |
Tenders from United States of America
AirportIQ System Manager (ASM) Password Modificati... Department of Aviation -Virginia Department of Aviation, 5702 Gulfstream Road, Richmond, VA 23250
Organization:
***************
Country:
United States of America
Deadline:
30.05.2026
FY'26-RFQ-OCTO-ZABBIT SOLUTION-DCSS SUPPLIERS ONLY District of Columbia Office of Contracting and Procurement (DC OCP)
Organization:
***************
Country:
United States of America
Deadline:
03.06.2026
FY26_GD0_PCE_ATC Ward 8 CCMA Lab Equipment District of Columbia Office of Contracting and Procurement (DC OCP)
Organization:
***************
Country:
United States of America
Deadline:
04.06.2026
Ris**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
09.06.2026
Ren**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
11.06.2026
RVR**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
12.06.2026
IFB**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
15.06.2026
Har**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
16.06.2026
DCR**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
16.06.2026
Wor**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
18.06.2026
N14**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
18.06.2026
26-**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
19.06.2026
BIZ**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
24.06.2026
Cul**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
24.06.2026
Van**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
30.06.2026
RFP**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
30.06.2026
RFP**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
07.07.2026
Aud**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
07.07.2026
Fut**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
30.08.2026
Lic**************************************************************************************************************************************
Organization:
***************
Country:
United States of America
Deadline:
30.08.2026



