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Title:
SEMISOL 2026
Country:
Japan
City:
Tokyo
Start Date:
09.06.2026
End Date:
11.06.2026
Venue:
Tokyo Big Sight Expected floor size ：1,080 sq.m.
Items to be Exhibited:
Materials, components, and manufacturing equipment technology for semiconductor post-processing, semiconductor manufacturing technology, chiplets (2.5D/3D packaging), advanced chiplet technology, semiconductor post-processing technologies, TSV (through-silicon via) and RDL (redistribution layer), packaging technology, materials, and components, heterogeneous bonding, sealing materials, resists, other materials and components, package substrates (printed circuit boards, tape substrates, ceramic substrates), package analysis and simulation software, grinding, dicing, die bonding, wire bonding, molding technologies, materials, equipment, and products, analytical equipment, inspection equipment, universities and research institutes
For Visitors:
Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
JTB Communication Design Inc. E-mail : [email protected] Inquiry Form : https://jcd-event.smktg.jp/public/application/add/2911
Frequency:
Annual
Last Fair Information:
SEMISOL 2026 June 10, 2026 - June 12, 2026 Tokyo / Japan / Asia Tokyo Big Sight Expected floor size ：1,080 sq.m. Materials, components, and manufacturing equipment technology for semiconductor post-processing, semiconductor manufacturing technology, chiplets (2.5D/3D packaging), advanced chiplet technology, semiconductor post-processing technologies, TSV (through-silicon via) and RDL (redistribution layer), packaging technology, materials, and components, heterogeneous bonding, sealing materials, resists, other materials and components, package substrates (printed circuit boards, tape substrates, ceramic substrates), package analysis and simulation software, grinding, dicing, die bonding, wire bonding, molding technologies, materials, equipment, and products, analytical equipment, inspection equipment, universities and research institutes Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. JTB Communication Design Inc. E-mail : [email protected] Form : https://jcd-event.smktg.jp/public/application/add/2911 For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website:
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Regions:
APEC Countries Asia Eastern Asia
Industries:
Telecommunication ／Telecommunication Data Processing Startups／Innovation Startups Machinery Industrial Technology ／Electric & Electronics (Products Machinery) Information Industrial Technology ／Testing Measuring & Analyzing Precision Mechanics Machinery Computer Innovation
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