Sign up now to have the right to view
50 tenders for free.
Online Trade Fair Details
| Title |
ASPS2024 - Advanced Semiconductor Packaging & Chiplet Show |
|||
|---|---|---|---|---|
You can sign up and unlock it for freeAccess to Public and Private Sector Business Opportunities for 200+ Countries |
||||
| Country | ||||
| City | Suwon | |||
| Regions | APEC Countries Asia Eastern Asia | |||
| Industries | Startups／Innovation Startups Logistics Machinery Industrial Technology ／Testing Measuring & Analyzing Precision Mechanics Machinery Industrial Technology ／Manufacturing Technology & Engineering Machinery Industrial Technology ／Advanced Technology/Materials Composites Industrial Technology ／Metals Metal Products Hardware Tools Machinery Packaging ／Packaging (Materials Machinery & Equipment) Innovation R & D Transportation | |||
| Start Date | 27.08.2024 | |||
| End Date | 29.08.2024 | |||
| Venue | Suwon Convention Center Expected floor size ：7,877 sq.m. | |||
| Items to be Exhibited | Semiconductor Packaging & Test Equipment, Semiconductor Packaging Materials & Parts, Semiconductor Packaging Technical Solutions, Wafer Processing Materials, Parts & Equipment | |||
| For Visitors | Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. | |||
| Organizer | Suwon Convention Center, J.EXPO LTD. The Electronic Times Address : 140, Gwanggyojungang-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea Person : Sharon Huh Tel : +82-31-303-6052 E-mail : sahuh@scc.or.kr | |||
| Message from Organizer | - | |||
| Frequency | Annual | |||
| Last Fair Information | ASPS2024 - Advanced Semiconductor Packaging & Chiplet Show August 28, 2024 - August 30, 2024 Suwon / Korea / Asia Suwon Convention Center Expected floor size ：7,877 sq.m. Semiconductor Packaging & Test Equipment, Semiconductor Packaging Materials & Parts, Semiconductor Packaging Technical Solutions, Wafer Processing Materials, Parts & Equipment Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. Suwon Convention Center, J.EXPO LTD. The Electronic Times Address : 140, Gwanggyojungang-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea Person : Sharon Huh Tel : +82-31-303-6052 E-mail : sahuh@scc.or.kr For more detailed information of the trade fair, please check the official website of the individual organizer. | |||
| Official Website | Official Website | |||
| Share | ||||
South Korea
| Title |
|---|
ASPS2024 - Advanced Semiconductor Packaging & Chiplet Show |
| Country |
|
South Korea
|
| City |
| Suwon |
| Regions |
| APEC Countries Asia Eastern Asia |
| Industries |
| Startups／Innovation Startups Logistics Machinery Industrial Technology ／Testing Measuring & Analyzing Precision Mechanics Machinery Industrial Technology ／Manufacturing Technology & Engineering Machinery Industrial Technology ／Advanced Technology/Materials Composites Industrial Technology ／Metals Metal Products Hardware Tools Machinery Packaging ／Packaging (Materials Machinery & Equipment) Innovation R & D Transportation |
| Start Date |
| 27.08.2024 |
| End Date |
| 29.08.2024 |
| Venue |
| Suwon Convention Center Expected floor size ：7,877 sq.m. |
| Items to be Exhibited |
| Semiconductor Packaging & Test Equipment, Semiconductor Packaging Materials & Parts, Semiconductor Packaging Technical Solutions, Wafer Processing Materials, Parts & Equipment |
| For Visitors |
| Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
| Suwon Convention Center, J.EXPO LTD. The Electronic Times Address : 140, Gwanggyojungang-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea Person : Sharon Huh Tel : +82-31-303-6052 E-mail : sahuh@scc.or.kr |
| Message from Organizer |
| Frequency |
| Annual |
| Last Fair Information |
| ASPS2024 - Advanced Semiconductor Packaging & Chiplet Show August 28, 2024 - August 30, 2024 Suwon / Korea / Asia Suwon Convention Center Expected floor size ：7,877 sq.m. Semiconductor Packaging & Test Equipment, Semiconductor Packaging Materials & Parts, Semiconductor Packaging Technical Solutions, Wafer Processing Materials, Parts & Equipment Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. Suwon Convention Center, J.EXPO LTD. The Electronic Times Address : 140, Gwanggyojungang-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea Person : Sharon Huh Tel : +82-31-303-6052 E-mail : sahuh@scc.or.kr For more detailed information of the trade fair, please check the official website of the individual organizer. |
| Official Website |
| Share |
To be notified
when a tender matching your filter is
published
To Follow
Tenders
Add New Tender Alert
To Follow
Contracts
Add New Contract Alert
To Follow
Fairs
Add New Fair Alert
