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Online Trade Fair Details
Title:
ASPS2024 - Advanced Semiconductor Packaging & Chiplet Show
Country:
City:
Suwon
Start Date:
27.08.2024
End Date:
29.08.2024
Venue:
Suwon Convention Center Expected floor size :7,877 sq.m.
Items to be Exhibited:
Semiconductor Packaging & Test Equipment, Semiconductor Packaging Materials & Parts, Semiconductor Packaging Technical Solutions, Wafer Processing Materials, Parts & Equipment
For Visitors:
Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
Suwon Convention Center, J.EXPO LTD. The Electronic Times Address : 140, Gwanggyojungang-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea Person : Sharon Huh Tel : +82-31-303-6052 E-mail : [email protected]
Frequency:
Annual
Last Fair Information:
ASPS2024 - Advanced Semiconductor Packaging & Chiplet Show August 28, 2024 - August 30, 2024 Suwon / Korea / Asia Suwon Convention Center Expected floor size :7,877 sq.m. Semiconductor Packaging & Test Equipment, Semiconductor Packaging Materials & Parts, Semiconductor Packaging Technical Solutions, Wafer Processing Materials, Parts & Equipment Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. Suwon Convention Center, J.EXPO LTD. The Electronic Times Address : 140, Gwanggyojungang-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea Person : Sharon Huh Tel : +82-31-303-6052 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website:
Regions:
Industries:
Startups/Innovation
Startups
Logistics
Machinery
Industrial Technology /Testing
Measuring & Analyzing
Precision Mechanics Machinery
Industrial Technology /Manufacturing Technology & Engineering Machinery
Industrial Technology /Advanced Technology/Materials
Composites
Industrial Technology /Metals
Metal Products
Hardware
Tools Machinery
Packaging /Packaging (Materials
Machinery & Equipment) Innovation
R & D Transportation
Online Trade Fair Details
| Title |
ASPS2024 - Advanced Semiconductor Packaging & Chiplet Show |
|||
|---|---|---|---|---|
3 Month Special Offer — Get 1 Month FreePay for 2 months, use 3 months. Unlimited premium access. |
||||
| Country | ||||
| City | Suwon | |||
| Regions | APEC Countries Asia Eastern Asia | |||
| Industries | Startups/Innovation Startups Logistics Machinery Industrial Technology /Testing Measuring & Analyzing Precision Mechanics Machinery Industrial Technology /Manufacturing Technology & Engineering Machinery Industrial Technology /Advanced Technology/Materials Composites Industrial Technology /Metals Metal Products Hardware Tools Machinery Packaging /Packaging (Materials Machinery & Equipment) Innovation R & D Transportation | |||
| Start Date | 27.08.2024 | |||
| End Date | 29.08.2024 | |||
| Venue | Suwon Convention Center Expected floor size :7,877 sq.m. | |||
| Items to be Exhibited | Semiconductor Packaging & Test Equipment, Semiconductor Packaging Materials & Parts, Semiconductor Packaging Technical Solutions, Wafer Processing Materials, Parts & Equipment | |||
| For Visitors | Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. | |||
| Organizer | Suwon Convention Center, J.EXPO LTD. The Electronic Times Address : 140, Gwanggyojungang-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea Person : Sharon Huh Tel : +82-31-303-6052 E-mail : [email protected] | |||
| Message from Organizer | - | |||
| Frequency | Annual | |||
| Last Fair Information | ASPS2024 - Advanced Semiconductor Packaging & Chiplet Show August 28, 2024 - August 30, 2024 Suwon / Korea / Asia Suwon Convention Center Expected floor size :7,877 sq.m. Semiconductor Packaging & Test Equipment, Semiconductor Packaging Materials & Parts, Semiconductor Packaging Technical Solutions, Wafer Processing Materials, Parts & Equipment Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. Suwon Convention Center, J.EXPO LTD. The Electronic Times Address : 140, Gwanggyojungang-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea Person : Sharon Huh Tel : +82-31-303-6052 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer. | |||
| Official Website | Official Website | |||
| Share | ||||
| Title |
|---|
ASPS2024 - Advanced Semiconductor Packaging & Chiplet Show |
| Country |
| City |
| Suwon |
| Regions |
| Industries |
|
Startups/Innovation
Startups
Logistics
Machinery
Industrial Technology /Testing
Measuring & Analyzing
Precision Mechanics Machinery
Industrial Technology /Manufacturing Technology & Engineering Machinery
Industrial Technology /Advanced Technology/Materials
Composites
Industrial Technology /Metals
Metal Products
Hardware
Tools Machinery
Packaging /Packaging (Materials
Machinery & Equipment) Innovation
R & D Transportation
|
| Start Date |
| 27.08.2024 |
| End Date |
| 29.08.2024 |
| Venue |
| Suwon Convention Center Expected floor size :7,877 sq.m. |
| Items to be Exhibited |
| Semiconductor Packaging & Test Equipment, Semiconductor Packaging Materials & Parts, Semiconductor Packaging Technical Solutions, Wafer Processing Materials, Parts & Equipment |
| For Visitors |
| Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. |
| Organizer |
| Suwon Convention Center, J.EXPO LTD. The Electronic Times Address : 140, Gwanggyojungang-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea Person : Sharon Huh Tel : +82-31-303-6052 E-mail : [email protected] |
| Message from Organizer |
| Frequency |
| Annual |
| Last Fair Information |
| ASPS2024 - Advanced Semiconductor Packaging & Chiplet Show August 28, 2024 - August 30, 2024 Suwon / Korea / Asia Suwon Convention Center Expected floor size :7,877 sq.m. Semiconductor Packaging & Test Equipment, Semiconductor Packaging Materials & Parts, Semiconductor Packaging Technical Solutions, Wafer Processing Materials, Parts & Equipment Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. Suwon Convention Center, J.EXPO LTD. The Electronic Times Address : 140, Gwanggyojungang-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea Person : Sharon Huh Tel : +82-31-303-6052 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer. |
| Official Website |
| Visit Official Website |
| Share |
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