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Title:
ASPS2024 - Advanced Semiconductor Packaging & Chiplet Show
Country:
South Korea
City:
Suwon
Start Date:
27.08.2024
End Date:
29.08.2024
Venue:
Suwon Convention Center Expected floor size ：7,877 sq.m.
Items to be Exhibited:
Semiconductor Packaging & Test Equipment, Semiconductor Packaging Materials & Parts, Semiconductor Packaging Technical Solutions, Wafer Processing Materials, Parts & Equipment
For Visitors:
Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
Suwon Convention Center, J.EXPO LTD. The Electronic Times Address : 140, Gwanggyojungang-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea Person : Sharon Huh Tel : +82-31-303-6052 E-mail : [email protected]
Frequency:
Annual
Last Fair Information:
ASPS2024 - Advanced Semiconductor Packaging & Chiplet Show August 28, 2024 - August 30, 2024 Suwon / Korea / Asia Suwon Convention Center Expected floor size ：7,877 sq.m. Semiconductor Packaging & Test Equipment, Semiconductor Packaging Materials & Parts, Semiconductor Packaging Technical Solutions, Wafer Processing Materials, Parts & Equipment Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. Suwon Convention Center, J.EXPO LTD. The Electronic Times Address : 140, Gwanggyojungang-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea Person : Sharon Huh Tel : +82-31-303-6052 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer.
Official Website:
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APEC Countries Asia Eastern Asia
Industries:
Startups／Innovation Startups Logistics Machinery Industrial Technology ／Testing Measuring & Analyzing Precision Mechanics Machinery Industrial Technology ／Manufacturing Technology & Engineering Machinery Industrial Technology ／Advanced Technology/Materials Composites Industrial Technology ／Metals Metal Products Hardware Tools Machinery Packaging ／Packaging (Materials Machinery & Equipment) Innovation R & D Transportation
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