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Title:
ASPS 2026 - Advanced Semiconductor Packaging & Chiplet Show
Country:
South Korea
City:
Suwon
Start Date:
25.08.2026
End Date:
27.08.2026
Venue:
Suwon Convention Center
Items to be Exhibited:
Semiconductor Packaging & Test Equipment, Semiconductor Packaging Materials, Parts & Thermal Management Solutions, Semiconductor Packaging Technical Solutions & EDA Software, Semiconductor Glass Substrates & Processing Materials, Wafer Processing Materials, Parts & Equipment
For Visitors:
Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly.
Organizer:
Gyeonggi-do, Suwon City Department : J. Expo Ltd. Tel : +82-2-6285-9131 E-mail : [email protected]
Frequency:
Annual
Last Fair Information:
ASPS 2026 - Advanced Semiconductor Packaging & Chiplet Show August 26, 2026 - August 28, 2026 Suwon / Korea / Asia Suwon Convention Center Semiconductor Packaging & Test Equipment, Semiconductor Packaging Materials, Parts & Thermal Management Solutions, Semiconductor Packaging Technical Solutions & EDA Software, Semiconductor Glass Substrates & Processing Materials, Wafer Processing Materials, Parts & Equipment Eligibility : Trade only Method of admission : Apply/register online For details, please contact the organizer directly. Gyeonggi-do, Suwon City Department : J. Expo Ltd. Tel : +82-2-6285-9131 E-mail : [email protected] For more detailed information of the trade fair, please check the official website of the individual organizer.
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Regions:
APEC Countries Asia Eastern Asia
Industries:
Startups／Innovation Startups Logistics Machinery Industrial Technology ／Testing Measuring & Analyzing Precision Mechanics Machinery Industrial Technology ／Manufacturing Technology & Engineering Machinery Industrial Technology ／Advanced Technology/Materials Composites Industrial Technology ／Metals Metal Products Hardware Tools Machinery Packaging ／Packaging (Materials Machinery & Equipment) Innovation R & D Transportation
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