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Project News Details
| Title |
Singulus develops new diamond wire multi wafer texturing process |
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|---|---|---|---|---|
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| Detail |
The German tooling firm announces the development of a new texturing process for multicrystalline wafers using diamond wire sawing on its LINEX inline system. Company believes process can boost multi wafer market in 2018.
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| Country | ||||
| Source | PV-Magazine | |||
| Regions | Africa Asia Australia Europe North America Oceania South America | |||
| Sectors | Chemicals Construction Computer Hardwares and Consumables | |||
| Published Date | 05.12.2017 | |||
| Original Url | Original Url | |||
| Share | ||||
International
| Title |
|---|
|
Singulus develops new diamond wire multi wafer texturing process
|
| Detail |
| The German tooling firm announces the development of a new texturing process for multicrystalline wafers using diamond wire sawing on its LINEX inline system. Company believes process can boost multi wafer market in 2018. |
| Country |
|
International
|
| Source |
| PV-Magazine |
| Regions |
| Africa Asia Australia Europe North America Oceania South America |
| Sectors |
| Chemicals Construction Computer Hardwares and Consumables |
| Published Date |
| 05.12.2017 |
| Original Url |
| Share |
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