Project News Details
Title:
First attempt to build back-contact micrometric III-V photovoltaic cells
Detail:
An international research group has utilized through-substrate-vias to create 3D interconnections in III-V solar cells with a triple-junction architecture. The novel cell design was found to have a low shading factor of below 3% and a 6-fold increase in wafer area use compared to cells based on 2D interconnects.
Source:
PV-Magazine
Published Date:
26.11.2023
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