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Project News Details
| Title |
First attempt to build back-contact micrometric III-V photovoltaic cells |
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|---|---|---|---|---|
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| Detail |
An international research group has utilized through-substrate-vias to create 3D interconnections in III-V solar cells with a triple-junction architecture. The novel cell design was found to have a low shading factor of below 3% and a 6-fold increase in wafer area use compared to cells based on 2D interconnects.
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| Country | ||||
| Source | PV-Magazine | |||
| Regions | Africa Asia Australia Europe North America Oceania South America | |||
| Sectors | Building Construction Energy-Power and Electrical Computer Hardwares and Consumables Building Material | |||
| Published Date | 26.11.2023 | |||
| Original Url | Original Url | |||
| Share | ||||
International
| Title |
|---|
|
First attempt to build back-contact micrometric III-V photovoltaic cells
|
| Detail |
| An international research group has utilized through-substrate-vias to create 3D interconnections in III-V solar cells with a triple-junction architecture. The novel cell design was found to have a low shading factor of below 3% and a 6-fold increase in wafer area use compared to cells based on 2D interconnects. |
| Country |
|
International
|
| Source |
| PV-Magazine |
| Regions |
| Africa Asia Australia Europe North America Oceania South America |
| Sectors |
| Building Construction Energy-Power and Electrical Computer Hardwares and Consumables Building Material |
| Published Date |
| 26.11.2023 |
| Original Url |
| Share |
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