Project News Details
Title
Assessing fractures in G12 monocrystalline wafer processing
Detail
Scientists in China have investigated the fracture strength of commercial G12 monocrystalline wafers via the 4-point bending test and have found that wafer thickness, the position of the silicon wafer in the silicon brick, and the bending test direction are key parameters to develop future strategies aimed at reducing fractures.
Country
International
Source
PV-Magazine
Regions
Africa Asia Australia Europe North America Oceania South America
Sectors
Construction Computer Hardwares and Consumables Steel
Published Date
13.10.2024
Original Url
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