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Title |
Assessing fractures in G12 monocrystalline wafer processing |
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Detail |
Scientists in China have investigated the fracture strength of commercial G12 monocrystalline wafers via the 4-point bending test and have found that wafer thickness, the position of the silicon wafer in the silicon brick, and the bending test direction are key parameters to develop future strategies aimed at reducing fractures.
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Country | ||||
Source | PV-Magazine | |||
Regions | Africa Asia Australia Europe North America Oceania South America | |||
Sectors | Construction Computer Hardwares and Consumables Steel | |||
Published Date | 13.10.2024 | |||
Original Url | Original Url | |||
Share |
Title |
---|
Assessing fractures in G12 monocrystalline wafer processing
|
Detail |
Scientists in China have investigated the fracture strength of commercial G12 monocrystalline wafers via the 4-point bending test and have found that wafer thickness, the position of the silicon wafer in the silicon brick, and the bending test direction are key parameters to develop future strategies aimed at reducing fractures. |
Country |
International
|
Source |
PV-Magazine |
Regions |
Africa Asia Australia Europe North America Oceania South America |
Sectors |
Construction Computer Hardwares and Consumables Steel |
Published Date |
13.10.2024 |
Original Url |
Share |
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