Project News Details
Title
Schmid develops new multi wafer texturing process
Detail
The German production manufacturer has announced the development of a new process for the texturing of diamond wire cut multi silicon wafers. Schmid says that it will ship the first systems featuring the new technology in the second quarter of 2017.
Country
International
Source
PV-Magazine
Regions
Africa Asia Australia Europe North America Oceania South America
Sectors
Construction Energy-Power and Electrical Computer Hardwares and Consumables
Published Date
02.02.2017
Original Url
Share
To be notified
when a tender matching your filter is published
To Follow
Tenders
Add New Tender Alert
To Follow
Contracts
Add New Contract Alert
To Follow
Fairs
Add New Fair Alert