Project News Details
Title:
Improving diamond wire sawing to reduce kerf loss in solar wafer production
Detail:
Researches in China have sought to assess how lateral vibration in diamond wire sawing can increase kerf losses in solar wafer manufacturing and have developed a predictive model than can reportedly help reduce them. Their analysis showed that, with constant sawing parameters, smaller wafers suffer from greater excess kerf loss.
Source:
PV-Magazine
Published Date:
16.09.2025
Share:
Export requests Import requests Partnership requests Service requests