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Title:
Amazon to Issue Bonds, Aiming to Raise Over $25 Billion for AI Infrastructure Investment
Detail:
Amazon plans to issue corporate bonds, seeking to raise more than $25 billion to fund investments in artificial intelligence infrastructure.
Country:
Japan
Source:
株探
Published Date:
06.07.2026
URL:
View Original URL
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Regions:
APEC Countries Asia Eastern Asia
Sectors:
Building Automobiles and Auto Parts Infrastructure Printing and Publishing Construction Computer Hardwares and Consumables Building Material
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