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| Title |
Xinlian Microelectronics Company Limited Thin Film Deposition Equipment Tender Notice International Competitive Bidding |
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| Country | ||||
| Language | English | |||
| Organization | ||||
| Published Date | 05.10.2024 | |||
| Deadline Date | 16.10.2024 | |||
| Overview |
Xinlian Microelectronics Company Limited Thin Film Deposition Equipment Project Name: Xinlian Microelectronics Company Limited Thin film deposition equipment Tenders are invited for Xinlian Microelectronics Company Limited Thin Film Deposition Equipment Products List: 1: Nitrogen-Doped Silicon Carbide Chemical Vapor Deposition Equipment(M1c Exc_dbx2) 2: Plasma Enhanced Medium Pressure Chemical Vapor Deposition Equipment for Silicon Nitride (Extm4-4wc Ext_sin X2) 3: Plasma Enhanced Dielectric Anti-Reflection Layer Chemical Vapor Deposition Equipment (Extm4-4wc Ext_darcx2) 4: W Cvd Process Tool Place of Implementation: Chongqing, China Beginning of Selling Bidding Documents: 2024-09-25 Ending of Selling Bidding Documents: 2024-10-08 Price of Bidding Documents: ?3000 $450 Deadline for Submitting Bids Time of Bid Opening (Beijing Time): 2024-10-16 09:00 XINLIAN MICROELECTRONICS CO.,LTD. Room 601-A153, SOHO Building, No. 28-2 Xiyong Avenue, Xiyong Street, High tech Zone, Chongqing, Attn: Mr Huang, Tel: +86-23-61386888 Tender Notice International Competitive Bidding 0613-244025124627 China GT-108206601
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| NAICS | ||||
| CPVS | ||||
| UNSPSC | ||||
| Regions | ||||
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| URL | ||||
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China
| Title |
|---|
Xinlian Microelectronics Company Limited Thin Film Deposition Equipment Tender Notice International Competitive Bidding |
| Country |
| Language |
| English |
| Organization |
| Published Date |
| 05.10.2024 |
| Deadline Date |
| 16.10.2024 |
| Overview |
| Xinlian Microelectronics Company Limited Thin Film Deposition Equipment Project Name: Xinlian Microelectronics Company Limited Thin film deposition equipment Tenders are invited for Xinlian Microelectronics Company Limited Thin Film Deposition Equipment Products List: 1: Nitrogen-Doped Silicon Carbide Chemical Vapor Deposition Equipment(M1c Exc_dbx2) 2: Plasma Enhanced Medium Pressure Chemical Vapor Deposition Equipment for Silicon Nitride (Extm4-4wc Ext_sin X2) 3: Plasma Enhanced Dielectric Anti-Reflection Layer Chemical Vapor Deposition Equipment (Extm4-4wc Ext_darcx2) 4: W Cvd Process Tool Place of Implementation: Chongqing, China Beginning of Selling Bidding Documents: 2024-09-25 Ending of Selling Bidding Documents: 2024-10-08 Price of Bidding Documents: ?3000 $450 Deadline for Submitting Bids Time of Bid Opening (Beijing Time): 2024-10-16 09:00 XINLIAN MICROELECTRONICS CO.,LTD. Room 601-A153, SOHO Building, No. 28-2 Xiyong Avenue, Xiyong Street, High tech Zone, Chongqing, Attn: Mr Huang, Tel: +86-23-61386888 Tender Notice International Competitive Bidding 0613-244025124627 China GT-108206601 |
| NAICS |
| Highway Machinery Highway International Highway Photographic Film Process |
| CPVS |
| Tools Film Carbides Nitrides Tool parts Tools, locks, keys, hinges, fasteners, chain and springs |
| UNSPSC |
| Equipment cases Financial Instruments, Products, Contracts and Agreements |
| Regions |
| APEC Countries Asia Eastern Asia |
| Sectors |
| Civil Works Building Postal and Courier Services Printing and Publishing Electricity Construction Energy-Power and Electrical Computer Hardwares and Consumables Electronics Building Material |
| URL |
| Share |
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