Tender Details
Title

200mm Wafer Box Cleaning Equipment Tender Notice International Competitive Bidding

Country
Language
English
Organization
Published Date
24.08.2024
Deadline Date
24.09.2024
Overview
200mm Wafer Box Cleaning Equipment Project Name: 200mm Wafer box cleaning equipment Tenders are invited for Advanced Micro Semiconductors Equipment Procurement Project Products List: 1: 200mm Wafer Box Cleaning Equipment Place of Implementation: Shanghai Beginning of Selling Bidding Documents: 2024-08-23 Ending of Selling Bidding Documents: 2024-08-30 Price of Bidding Documents: ?1000 $150 Deadline for Submitting Bids Time of Bid Opening (Beijing Time): 2024-09-24 14:00 ADVANCED MICRO SEMICONDUCTORS CO., LTD. Floor 3 Building B, No. 888, Huanhu West 2nd Road, Lingang New District, China (Shanghai) pilot Free Trade Zone, Attn: Jenny Wu, Tel: +86-21- 61659720 Tender Notice International Competitive Bidding 0705-244004044082 China GT-106228705
NAICS
Machinery International Metal Can
CPVS
Construction work for pipelines, communication and power lines, for highways, roads, airfields and ra... Construction, foundation and surface works for highways, roads Foundation work for highways, roads, streets and footpaths Construction work for highways, roads Semiconductors Boxes
UNSPSC
Equipment cases Cleaning, sorting, and grading machine parts and accessories Boxes Financial Instruments, Products, Contracts and Agreements
Regions
APEC Countries Asia Eastern Asia
Sectors
Civil Works Building Roads and Highways-Bridge Printing and Publishing Construction Energy-Power and Electrical Computer Hardwares and Consumables Building Material
URL
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