Tender Details
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Title

Flip-Chip Bonder Tender Notice International Competitive Bid... ***** Flip-Chip Bonder Tender Notice International Competitive Bid... *****

Country
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Language
English
Organization
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Overview
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NAICS
Hardware Other Foundation Other Foundation Colleges Colleges International Colleges Foundation Process
CPVS
Tools Parts of structures Foundation work System, storage and content management software package Iridium, gallium, indium, thallium and barium Indium Structures and parts System, storage and content management software development services Hardware Tool parts Manuals Tools, locks, keys, hinges, fasteners, chain and springs
UNSPSC
Hardware Software University Suction pump, manual Clinical laboratory and toxicology testing systems, components, and supplies Clinical laboratory and toxicology testing systems, components, and supplies
Regions
Europe Northern Europe Western Europe
Sectors
Building Automobiles and Auto Parts Postal and Courier Services Roads and Highways-Bridge Infrastructure Printing and Publishing Railways-Rail-Railroad Defence and Security Construction Energy-Power and Electrical Computer Hardwares and Consumables Electronics Building Material Marine
URL
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