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| Title |
3D Printer for Packaging Materials, Qty: 1 Tender Notice Domestic Competitive Bidding |
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| Country | ||||
| Language | English | |||
| Organization | ||||
| Published Date | 05.10.2024 | |||
| Deadline Date | 26.10.2024 | |||
| Overview |
3D Printer for Packaging Materials, Qty: 1 3D printer for packaging materials INDIAN INSTITUTE OF PACKAGING (IIP) Address: Indian Institute Of Packaging, Plot E2 Midc Area, Road No. 8, Andheri East, Mumbai 400093 City: Mumbai District: Mumbai State: Maharashtra Pin: 400093 Tel Fax: 0120-4200462, 0120-4001002, 0120-4002789 addlceo@gem.gov.in Tender Notice Domestic Competitive Bidding GEM 2024 B 5473282 India GT-108228696
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| NAICS |
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| CPVS | ||||
| UNSPSC | ||||
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India
| Title |
|---|
3D Printer for Packaging Materials, Qty: 1 Tender Notice Domestic Competitive Bidding |
| Country |
| Language |
| English |
| Organization |
| Published Date |
| 05.10.2024 |
| Deadline Date |
| 26.10.2024 |
| Overview |
| 3D Printer for Packaging Materials, Qty: 1 3D printer for packaging materials INDIAN INSTITUTE OF PACKAGING (IIP) Address: Indian Institute Of Packaging, Plot E2 Midc Area, Road No. 8, Andheri East, Mumbai 400093 City: Mumbai District: Mumbai State: Maharashtra Pin: 400093 Tel Fax: 0120-4200462, 0120-4001002, 0120-4002789 addlceo@gem.gov.in Tender Notice Domestic Competitive Bidding GEM 2024 B 5473282 India GT-108228696 |
| NAICS |
| - |
| CPVS |
| Construction work for pipelines, communication and power lines, for highways, roads, airfields and ra... Construction, foundation and surface works for highways, roads Foundation work for highways, roads, streets and footpaths Construction work for highways, roads |
| UNSPSC |
| Printer, scanner and multifunctional equipment maintenance Packaging case |
| Regions |
| Asia SAARC Countries South Asia |
| Sectors |
| Roads and Highways-Bridge Printing and Publishing Defence and Security Construction Energy-Power and Electrical Computer Hardwares and Consumables |
| URL |
| Share |
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