Tender Details
Title

HPM用L帯半導体モジュールの製造 HPM用L帯半導体モジュ... ***** Manufacturing of L-band semiconductor modules for HPM Manufa... *****

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Japanese
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APEC Countries Asia Eastern Asia
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Civil Works Building Banking-Finance-Insurance Postal and Courier Services Roads and Highways-Bridge Telecommunications Water and Sanitation Law and Legal Defence and Security Construction Computer Hardwares and Consumables Electronics Building Material
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Language: Japanese
Deadline Date: 30.10.2024