Tender Details
Title

Low-Cost Chip-To-Chip Interface Element Circuit Test Chip Design Complete Set Tender Notice International Competitive Bidding

Country
Language
English
Organization
Published Date
02.07.2024
Deadline Date
16.07.2024
Overview
Low-Cost Chip-To-Chip Interface Element Circuit Test Chip Design Complete Set Low-cost chip-to-chip interface element circuit test chip design complete set Explanation: Low-cost chip-to-chip interface element circuit test chip design complete set ?No. 19 1 Procurement details (1) Item classification number 71, 27 (2) Purchase etc. subject and Quantity Low cost chip-to-chip interface element circuit test chip design...8610ded6ae1f9c19659bfa9bcb7344e7 NATIONAL UNIVERSITY CORPORATION UNIVERSITY OF TOKYO Japan [Disclaimer : For Exact Organization Tendering Authority details, please refer the tender notice.] Tender Notice International Competitive Bidding Japan GT-103547494
NAICS
Colleges Colleges International Colleges
CPVS
Designs
UNSPSC
Interfaces University
Regions
APEC Countries Asia Eastern Asia
Sectors
Printing and Publishing Construction Energy-Power and Electrical Computer Hardwares and Consumables Marine
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