Tender Details
Title
Provision of One (1) Unit of Fully Automated Wafer Substrate and Film Thickness, Wafer Bow and Warpage, and Stress Measurement Metrology System Tender Notice International Competitive Bidding
Country
Language
English
Organization
Published Date
05.06.2024
Deadline Date
01.07.2024
Overview
Provision of One (1) Unit of Fully Automated Wafer Substrate and Film Thickness, Wafer Bow and Warpage, and Stress Measurement Metrology System Provision of One (1) Unit of Fully Automated Wafer Substrate and Film thickness, Wafer bow and warpage, and stress measurement metrology system AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH 20 Biopolis Way, Centros, \ 08-01, Singapore 138668 Phone : 64074206 Fax : leowje@hq.a-star.edu.sg Tender Notice International Competitive Bidding NST000ETT24000037 Singapore GT-102137612
NAICS
International Agencies
CPVS
System, storage and content management software package Film Research, testing and scientific technical simulator System, storage and content management software development services
UNSPSC
IP phones
Regions
APEC Countries Asia
Sectors
Automobiles and Auto Parts Printing and Publishing Construction Energy-Power and Electrical Computer Hardwares and Consumables
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